Journal Of Electronic Materials投稿须知

期刊简介

《Journal Of Electronic Materials》是由Springer US出版社于1972年创办的英文国际期刊（ISSN: 0361-5235，E-ISSN: 1543-186X），该期刊长期致力于工程：电子与电气领域的创新研究，主要研究方向为工程技术-材料科学：综合。作为SCIE收录期刊（JCR分区 Q3，中科院 4区），本刊采用OA未开放获取模式（OA占比0.0200...%），以发表工程：电子与电气领域等方向的原创性研究为核心（研究类文章占比97.49%%）。凭借严格的同行评审与高效编辑流程，期刊年载文量精选控制在716篇，确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库，为学者提供推动工程技术领域高水平交流平台。

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Journal Of Electronic Materials审稿周期约为约3.0个月。该刊近年未被列入国际预警名单，年发文量约716篇，录用竞争适中，主题需确保紧密契合工程技术前沿。投稿策略提示：避开学术会议旺季投稿以缩短周期，语言建议专业润色提升可读性。

工程技术 大类学科
English 出版语言
否是否预警
SCIE 期刊收录
716 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊	综述期刊	大类学科	小类学科
否	否	工程技术 4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 4区 4区 4区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊	综述期刊	大类学科	小类学科
否	否	工程技术 4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 4区 4区 4区

JCR分区

按JIF指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	183 / 352	48.2%
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q3	280 / 438	36.2%
学科：PHYSICS, APPLIED	SCIE	Q3	104 / 179	42.2%

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	217 / 354	38.84%
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q3	273 / 438	37.79%
学科：PHYSICS, APPLIED	SCIE	Q3	115 / 179	36.03%

CiteScore

SJR

SNIP

CiteScore 排名

CiteScore：4.1

SJR：0.439

SNIP：0.668

学科类别	分区	排名	百分位
大类：Engineering 小类：Electrical and Electronic Engineering	Q2	314 / 797	60%
大类：Engineering 小类：Condensed Matter Physics	Q2	174 / 434	60%
大类：Engineering 小类：Electronic, Optical and Magnetic Materials	Q2	129 / 284	54%
大类：Engineering 小类：Materials Chemistry	Q2	145 / 317	54%

期刊发文

First-Principles Study on C3N4 Intermediate Band Materials
Author: Yin, Jianbo; Yan, Xiaobin; Zhu, Min

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 376-383. DOI: 10.1007/s11664-022-09996-8
Thermoelectric Performance of n-Type Polycrystalline Bi2Te3 by Melt Spinning Following High-Pressure Sintering
Author: Wu, Fang; Wang, Wei

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 276-283. DOI: 10.1007/s11664-022-09985-x
K2FeO4-Assisted Preparation of Discarded Badminton Shuttlecock Feather-Derived Hierarchical Porous Carbon for High-Performance Supercapacitors
Author: Liu, Xinru; Yang, Jianwei; Bian, Zhentao; Zhao, Xuanxuan; Zhu, Yanyan; Wang, Hongyan; Song, Lei; Chu, Juncai; Zhang, Ying; Ye, Ziyan

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 402-413. DOI: 10.1007/s11664-022-10000-6
Evolution of Microstructure and Mechanical Properties of Copper Pillar Solder Joints Under Ultrasound
Author: Li, Kui; Wu, Daowei; Lu, Peiyuan; Li, Zhankun; Li, Junhui

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 327-341. DOI: 10.1007/s11664-022-09992-y
Study on the Enhancement of Light Intensity and High Color Rendering Index of a White Light Emitting Diode
Author: Hu, Shao-Hwa; Lin, Yen-Sheng; Su, Shui-Hsiang; Dai, Hang; He, Jing-Shi

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 270-275. DOI: 10.1007/s11664-022-09983-z
Experimental and Field Study of a Pavement Thermoelectric Energy Harvesting System Based on the Seebeck Effect
Author: Xie, Zhongwu; Shi, Kaixi; Song, Laifu; Hou, Xiran

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 209-218. DOI: 10.1007/s11664-022-09967-z
Titanium Carbide/Carbon-Supported Platinum Nanoparticles Boost Oxygen Reduction Reaction for Fuel Cells
Author: Zheng, Cheng; Sun, Xueqin; Qin, Yanxi; Guo, Yan; Yan, Jingjing; Tong, Xili

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 342-350. DOI: 10.1007/s11664-022-09993-x
Vapor-Phase Epitaxial Growth of Large-Scale High Crystalline Sb2Se3 Nanowires for Photodetector Application
Author: Sun, Guangzhuang; Ling, Runze; Cai, Yang; Wang, Anrong

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2023; Vol. 52, Issue 1, pp. 368-375. DOI: 10.1007/s11664-022-09995-9

Journal Of Electronic Materials

电子材料学报

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中科院分区

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