Ieee Transactions On Circuits And Systems Ii-express Briefs

Ieee Transactions On Circuits And Systems Ii-express Briefs

IEEE Transactions On Circuits and Systems Ii-express 简报

  • 2区 中科院分区
  • Q2 JCR分区

期刊简介

《Ieee Transactions On Circuits And Systems Ii-express Briefs》是由Institute of Electrical and Electronics Engineers Inc.出版社于1992年创办的英文国际期刊(ISSN: 1549-7747,E-ISSN: 1558-3791),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为工程:电子与电气-工程技术。作为SCIE收录期刊(JCR分区 Q2,中科院 2区),本刊采用OA未开放获取模式(OA占比0%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比100.00%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在912篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

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投稿提示

Ieee Transactions On Circuits And Systems Ii-express Briefs审稿周期约为 约3.0个月 。该刊近年未被列入国际预警名单,年发文量约912篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 912 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 100 / 352

71.7%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 80 / 354

77.54%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:7.9 SJR:1.523 SNIP:1.513
学科类别 分区 排名 百分位
大类:Engineering 小类:Electrical and Electronic Engineering Q1 137 / 797

82%

期刊发文

  • Input Mapping Design for Batch-to-Batch Optimization With Limited Memory

    Author: Zhou, Yuanqiang; Li, Dewei; Gao, Furong

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 171-175. DOI: 10.1109/TCSII.2022.3205925

  • An FPGA-Based Transformer Accelerator Using Output Block Stationary Dataflow for Object Recognition Applications

    Author: Zhao, Zhongyu; Cao, Rujian; Un, Ka-Fai; Yu, Wei-Han; Mak, Pui-In; Martins, Rui P.

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 281-285. DOI: 10.1109/TCSII.2022.3196055

  • On the DC-Settling Process of the Pierce Crystal Oscillator in Start-Up

    Author: Zhang, Zehao; Yang, Shiheng; Liu, Yueduo; Zhu, Zihao; Lin, Jiahui; Bao, Rongxin; Xu, Tailong; Yang, Zhizhan; Zhang, Mingkang; Liu, Jiaxin; Zhou, Xiong; Yin, Jun; Mak, Pui-In; Li, Qiang

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 26-30. DOI: 10.1109/TCSII.2022.3209025

  • An Optimal Combining Attack Strategy Against Economic Dispatch of Integrated Energy System

    Author: Zhang, Yunning; Xie, Xuexin; Fu, Wenlong; Chen, Xi; Hu, Songlin; Zhang, Lei; Xia, Yuhang

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 246-250. DOI: 10.1109/TCSII.2022.3196931

  • A Simplifying-Matrix Method to Reduce the Storage Complexity in Studying Finite State Machines in the Framework of STP

    Author: Yue, Jumei; Yan, Yongyi; Chen, Zengqiang

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 196-200. DOI: 10.1109/TCSII.2022.3193994

  • Consensus of Multiagent Systems With Intermittent Communication via Extended State Observer

    Author: Yu, Rongling; He, Ping; Li, Heng; Cao, Jiannong; Deng, Feiqi

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 231-235. DOI: 10.1109/TCSII.2022.3197328

  • Complex Dynamics, Hardware Implementation and Image Encryption Application of Multiscroll Memeristive Hopfield Neural Network With a Novel Local Active Memeristor

    Author: Yu, Fei; Kong, Xinxin; Mokbel, Abdulmajeed Abdullah Mohammed; Yao, Wei; Cai, Shuo

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 326-330. DOI: 10.1109/TCSII.2022.3218468

  • Design of Nonreciprocal Multifunctional Reflectionless Bandpass Filters by Using Circulators

    Author: Yang, Yuhao; Wu, Yongle; Wang, Weimin

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS. 2023; Vol. 70, Issue 1, pp. 106-110. DOI: 10.1109/TCSII.2022.3208254