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EaD: ECC-Assisted Deduplication With High Performance and Low Memory Overhead for Ultra-Low Latency Flash Storage
Author: Wu, Suzhen; Du, Chunfeng; Zhu, Weidong; Zhou, Jindong; Jiang, Hong; Mao, Bo; Zeng, Lingfang
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 1, pp. 208-221. DOI: 10.1109/TC.2022.3152665
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Comparing Communication Paradigms in Cause-Effect Chains
Author: Tang, Yue; Jiang, Xu; Guan, Nan; Ji, Dong; Luo, Xiantong; Yi, Wang
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 1, pp. 82-96. DOI: 10.1109/TC.2022.3197082
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A Unified Blocking Analysis for Parallel Tasks With Spin Locks Under Global Fixed Priority Scheduling
Author: Jiang, Xu; Chen, Zewei; Yang, Maolin; Guan, Nan; Tang, Yue; Wang, Yi
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 1, pp. 15-28. DOI: 10.1109/TC.2022.3198634
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Dynamic Scheduling Strategies for Firm Semi-Periodic Real-Time Tasks
Author: Gao, Yiqin; Pallez, Guillaume; Robert, Yves; Vivien, Frederic
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 1, pp. 55-68. DOI: 10.1109/TC.2022.3208203
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IVP: An Intelligent Video Processing Architecture for Video Streaming
Author: Gao, Chengsi; Wang, Ying; Han, Yinhe; Chen, Weiwei; Zhang, Lei
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 1, pp. 264-277. DOI: 10.1109/TC.2022.3155950
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Fenglin-I: An Open-Source Time-Sensitive Networking Chip Enabling Agile Customization
Author: Fu, Wenwen; Quan, Wei; Yan, Jinli; Sun, Zhigang
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 1, pp. 140-153. DOI: 10.1109/TC.2022.3188179
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Sky-Sorter: A Processing-in-Memory Architecture for Large-Scale Sorting
Author: Zokaee, Farzaneh; Chen, Fan; Sun, Guangyu; Jiang, Lei
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 2, pp. 480-493. DOI: 10.1109/TC.2022.3169434
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Malware-on-the-Brain: Illuminating Malware Byte Codes With Images for Malware Classification
Author: Zhong, Fangtian; Chen, Zekai; Xu, Minghui; Zhang, Guoming; Yu, Dongxiao; Cheng, Xiuzhen
Journal: IEEE TRANSACTIONS ON COMPUTERS. 2023; Vol. 72, Issue 2, pp. 438-451. DOI: 10.1109/TC.2022.3160357