Ieee Transactions On Microwave Theory And Techniques

Ieee Transactions On Microwave Theory And Techniques

IEEE 微波理论与技术汇刊

  • 1区 中科院分区
  • Q2 JCR分区

期刊简介

《Ieee Transactions On Microwave Theory And Techniques》是由Institute of Electrical and Electronics Engineers Inc.出版社于1963年创办的英文国际期刊(ISSN: 0018-9480,E-ISSN: 1557-9670),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为工程技术-工程:电子与电气。作为SCIE收录期刊(JCR分区 Q2,中科院 1区),本刊采用OA未开放获取模式(OA占比0%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比99.83%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在593篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

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投稿提示

Ieee Transactions On Microwave Theory And Techniques审稿周期约为 约6.0个月 。该刊近年未被列入国际预警名单,年发文量约593篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 593 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
1区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
1区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 94 / 352

73.4%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 99 / 354

72.18%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:8.6 SJR:1.633 SNIP:1.696
学科类别 分区 排名 百分位
大类:Physics and Astronomy 小类:Radiation Q1 4 / 58

93%

大类:Physics and Astronomy 小类:Condensed Matter Physics Q1 52 / 434

88%

大类:Physics and Astronomy 小类:Electrical and Electronic Engineering Q1 120 / 797

85%

期刊发文

  • Three-Dimensional Interconnection With Magnetically Coupled Transition for W-Band Integration Applications

    Author: Sun, Jian Xu; Cheng, Yu Jian; Wang, Lei; Fan, Yong

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 1, pp. 112-121. DOI: 10.1109/TMTT.2022.3169138

  • Accurate Detection of Doppler Cardiograms With a Parameterized Respiratory Filter Technique Using a K-Band Radar Sensor

    Author: Dong, Shuqin; Li, Yuchen; Lu, Jingyun; Zhang, Zhi; Gu, Changzhan; Mao, Junfa

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 1, pp. 71-82. DOI: 10.1109/TMTT.2022.3184019

  • NSRR Microwave Sensor Based on PLL Technology for Glucose Detection

    Author: Fu, Xiaodong; Wu, Jiakang; Wang, Xiao; Gu, Xiaofeng; Wang, Cong; Wu, Yongle; Liang, Junge

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 2, pp. 763-772. DOI: 10.1109/TMTT.2022.3193696

  • High-Efficiency and High-Current GaN-Based Microwave Rectifier for Wireless Strain Sensing and Monitoring

    Author: Liu, Tao; Li, Yang; Yang, Jia-Yi; Wang, Ting-Ting; Wang, Xiao; Yang, Lin-An; Dickey, Michael; Ao, Jin-Ping; Hao, Yue

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 2, pp. 898-906. DOI: 10.1109/TMTT.2022.3197407

  • Memory Feature-Based Sample Selection Strategy for Few-Sample Learning Digital Predistortion

    Author: Yang, Guichen; Qiao, Wen; Jiang, Chengye; Su, Lei; Han, Renlong; Tan, Jingchao; Liu, Falin

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 2, pp. 602-612. DOI: 10.1109/TMTT.2022.3199482

  • Higher Order CPML for Leapfrog Complying-Divergence Implicit FDTD Method and Its Numerical Properties

    Author: Liu, Shuo; Tan, Eng Leong; Zou, Bin; Zhang, Lamei

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 2, pp. 522-535. DOI: 10.1109/TMTT.2022.3199493

  • Harmonic-Based Integrated Rectifier-Transmitter for Uncompromised Harvesting and Low-Power Uplink

    Author: Wu, Pengde; Gao, Si-Ping; Chen, Yi-Dan; Ren, Zhi Hua; Yu, Pengyu; Guo, Yongxin

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 2, pp. 870-880. DOI: 10.1109/TMTT.2022.3200101

  • An Advanced Calibration Method for Probe Leakage Correction in On-Wafer Test Systems

    Author: Wang, Yibang; Fu, Xingchang; Wu, Aihua; Huo, Ye; Liu, Chen; Luan, Peng; Lei, Lihua; Liang, Faguo; Li, Chong

    Journal: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023; Vol. 71, Issue 2, pp. 682-690. DOI: 10.1109/TMTT.2022.3200050