Acs Applied Electronic Materials

Acs Applied Electronic Materials

Acs 应用电子材料

  • 3区 中科院分区
  • Q1 JCR分区

期刊简介

《Acs Applied Electronic Materials》是由American Chemical Society出版社于2019年创办的英文国际期刊(ISSN: 2637-6113,E-ISSN: 2637-6113),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为Multiple。作为SCIE收录期刊(JCR分区 Q1,中科院 3区),本刊采用OA开放获取模式(OA占比0.0245...%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比93.85%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在748篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动材料科学领域高水平交流平台。

投稿咨询

投稿提示

Acs Applied Electronic Materials审稿周期约为 。该刊近年未被列入国际预警名单,年发文量约748篇,录用竞争适中,主题需确保紧密契合材料科学前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 材料科学 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 748 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
材料科学
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合
3区 3区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
材料科学
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合
3区 3区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 83 / 352

76.6%

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q2 151 / 438

65.6%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 117 / 354

67.09%

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q2 131 / 438

70.21%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:7.2 SJR:1.058 SNIP:0.929
学科类别 分区 排名 百分位
大类:Materials Science 小类:Electronic, Optical and Magnetic Materials Q1 59 / 284

79%

大类:Materials Science 小类:Materials Chemistry Q1 75 / 317

76%

大类:Materials Science 小类:Electrochemistry Q2 22 / 60

64%

期刊发文

  • Synthesis of Two-Dimensional Hexagonal Boron Nitride and Mid-Infrared Nanophotonics

    Author: Shi, Ningqiang; Li, Ling; Gao, Peng; Jiang, Xiangqian; Hao, Jiandong; Ban, Chuncheng; Zhang, Ruigeng; Liu, Zhenxing

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. 5, Issue 1, pp. 34-65. DOI: 10.1021/acsaelm.2c01083

  • High-Performance Flexible Triboelectric Nanogenerator Based on Environmentally Friendly, Low-Cost Sodium Carboxymethylcellulose for Energy Harvesting and Self-Powered Sensing

    Author: He, Jinmei; Xue, Yuyu; Sun, Wenchao; Shen, Lei; Zhao, Yue; Yan, Jufeng; Wu, Yaxin; Zhang, Bin; Qu, Mengnan

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. 5, Issue 1, pp. 291-301. DOI: 10.1021/acsaelm.2c01335

  • Radiation-Tolerant Proton Detector Based on the MAPbBr3 Single Crystal

    Author: Huang, Huaqing; Guo, Linxin; Zhao, Yunbiao; Peng, Shengyuan; Ma, Wenjun; Wang, Xinwei; Xue, Jianming

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. 5, Issue 1, pp. 381-387. DOI: 10.1021/acsaelm.2c01406

  • Fullerene Transformed into a 3-D Structure of Nitrogen-Doped Few- Layer Graphene Sheets: Growth and Field Emission Properties

    Author: Fan, Lining; Chen, Wei; Zhou, Ke; Zheng, Hui; Zheng, Peng; Zheng, Liang; Zhang, Yang

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. 5, Issue 1, pp. 123-131. DOI: 10.1021/acsaelm.2c00596

  • Edge-Active Enriched MoS2 Porous Nanosheets as Efficient Pt-Free Catalysts toward the Triiodide Reduction Reaction

    Author: Cao, Yuying; Yu, Peng; Wang, Liyan; Wang, Xiuwen; Li, Lantian; Yu, Miao; Sun, Chuang; Liu, Zuhui; Zhao, Bing

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. 5, Issue 1, pp. 429-439. DOI: 10.1021/acsaelm.2c01445

  • Additively Manufactured Zinc Oxide Thin-Film Transistors Using Directed Assembly

    Author: Chai, Zhimin; Abbasi, Salman A.; Busnaina, Ahmed A.

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. , Issue , pp. -. DOI: 10.1021/acsaelm.3c00143

  • Flexible 1-3 Piezoelectric Composites with Soft Embedded Conductive Interconnects for Underwater Acoustic Transducers

    Author: Hao, Shaohua; Zhong, Chao; Zhang, Yanjun; Chen, Yanxia; Wang, Likun; Qin, Lei

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. , Issue , pp. -. DOI: 10.1021/acsaelm.3c00155

  • Theoretical Study of Intercalation Effects: Graphene and hBN Layers in Metal and Monolayer Black Phosphorus Contacts

    Author: Shen, Na

    Journal: ACS APPLIED ELECTRONIC MATERIALS. 2023; Vol. , Issue , pp. -. DOI: 10.1021/acsaelm.3c00107