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Formation mechanism and mechanical properties of compliant interconnects incorporating Cu nanowire arrays for heterogeneous integratio
Author: Li, Yuejun; Chen, Xing; Ma, Lushan; Lin, Xinlong; Wang, Chao; Li, Ziqiang; Liu, Wei; Tian, Ye; Wu, Fengshun
Journal: JOURNAL OF ADVANCED JOINING PROCESSES. 2026; Vol. 13, Issue , pp. -. DOI: 10.1016/j.jajp.2026.100386
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Evolution law of thermal strain during the adhesive repair process of edge-cracked Al alloy and its influence on mechanical propertie
Author: Li, Yongbin; Zhou, Fei; Zhang, Xiaoyu; Miao, Chunhe; Wang, Yuan; Liu, Peng; Liu, Shun; Rong, Youmin; Xu, Jiajun
Journal: JOURNAL OF ADVANCED JOINING PROCESSES. 2026; Vol. 13, Issue , pp. -. DOI: 10.1016/j.jajp.2026.100394
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The Influence of temperature on the microstructure and properties of Cu/Al tube joints in magnetic pulse-assisted semi-solid brazin
Author: Rui, Zhenglei; Huang, Shangyu; Wang, Huajun; Meng, Zhenghua
Journal: JOURNAL OF ADVANCED JOINING PROCESSES. 2025; Vol. 11, Issue , pp. -. DOI: 10.1016/j.jajp.2025.100313
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Direct bonding mechanism of titanium and PET resin via heating and pressurization: Influence of bubble dynamics on bonding strengt
Author: Kondoh, Katsuyoshi; Nishimura, Nodoka; Shitara, Kazuki; Kariya, Shota; Chen, Ke; Umeda, Junko
Journal: JOURNAL OF ADVANCED JOINING PROCESSES. 2025; Vol. 11, Issue , pp. -. DOI: 10.1016/j.jajp.2025.100301
