Ieee Open Journal Of The Industrial Electronics Society

Ieee Open Journal Of The Industrial Electronics Society

IEEE 工业电子学会开放期刊

  • 3区 中科院分区
  • Q2 JCR分区

期刊简介

《Ieee Open Journal Of The Industrial Electronics Society》是由IEEE出版社创办的英文国际期刊(ISSN: 2644-1284),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为ENGINEERING, ELECTRICAL & ELECTRONIC。作为SCIE收录期刊(JCR分区 Q2,中科院 3区),本刊采用OA未开放获取模式(OA占比%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比98.23%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在113篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

投稿咨询

投稿提示

Ieee Open Journal Of The Industrial Electronics Society审稿周期约为12 Weeks。该刊近年未被列入国际预警名单,年发文量约113篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 113 发文量

中科院分区

《新锐期刊分区表》(2026年3月发布)

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区

期刊分区表(2025年3月升级版)

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC ESCI Q2 108 / 369

70.9

学科:ENGINEERING, ELECTRICAL & ELECTRONIC ESCI Q2 102 / 371

72.64

2023-2024年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC ESCI Q1 61 / 352

82.8

学科:ENGINEERING, ELECTRICAL & ELECTRONIC ESCI Q1 72 / 354

79.8

CiteScore(2026年6月最新版)

CiteScore SJR SNIP CiteScore 排名
CiteScore:9.1 SJR:1.231 SNIP:1.713
学科类别 分区 排名 百分位
大类:Engineering 小类:Industrial and Manufacturing Engineering Q1 56 / 425

86%

大类:Engineering 小类:Electrical and Electronic Engineering Q1 140 / 1030

86%

大类:Engineering 小类:Control and Systems Engineering Q1 57 / 390

85%

期刊发文

  • Advances and Challenges for Magnetic Planarization and Integration - An Overvie

    Author: Liu, Yue; Wu, Hongfei; Jiang, Chaoqiang; Ren, Xufu; An, Shaoliang; Long, Teng

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 747-765. DOI: 10.1109/OJIES.2026.3679790

  • Module Power Balance Modulation Method for Cascaded Multilevel Inverters With Full Modulation Ratio Rang

    Author: Ma, Yang; Chen, Zhong; Gan, Jiakai; Huang, Lexuan; Xu, Yaming

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 369-381. DOI: 10.1109/OJIES.2026.3660150

  • A Novel Continuous Control Set Model Predictive Control of Three-Phase Single-Stage Differential Boost Inverte

    Author: Liu, Yushan; Feng, Xiangkai; Zhou, Longtao; Liu, Yupeng; Rivera, Marco; Wheeler, Patrick

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 563-575. DOI: 10.1109/OJIES.2026.3668298

  • Biomimetic Food Bolus Preparation Using TriChewer: A Multi-Oral-Chamber Chewing Robo

    Author: Wang, Xudong; Chen, Bangxiang; Singh Dhupia, Jaspreet; Xu, Weiliang

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 104-118. DOI: 10.1109/OJIES.2025.3648797

  • Modeling, Analysis, Resilience Improvement of Autonomous AC Microgrids With Virtual Output Impedance Control Under False Data Injection Attack

    Author: Huang, Yifeng; Wu, Mianzhi; Xue, Fei; Jiang, Lin; Lim, Chee Shen

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 119-135. DOI: 10.1109/OJIES.2025.3648782

  • New Nine-Level Common-Ground Multilevel Inverter With Boosting Capability for Renewable Energie

    Author: Abbasi, Maysam; Marangalu, Milad Ghavipanjeh; Kurdkandi, Naser Vosoughi; Abbasi, Ehsan; Vahedi, Hani; Li, Li; Aguilera, Ricardo P.; Lu, Dylan; Wang, Fei

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 86-103. DOI: 10.1109/OJIES.2025.3648255

  • Planning of Current Transients to Follow MTPA Trajector

    Author: Dianov, Anton; Anuchin, Alecksey; Litvinchev, Igor; Sun, Xiaodong; Demidova, Galina; Prakht, Vladimir

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 42-54. DOI: 10.1109/OJIES.2025.3645998

  • OBC and APM Integration Topology and Decoupling Design for Solar Electric Vehicl

    Author: Rong, Desheng; Lin, Zhongbao; Sun, Xuanjin; Han, Yadong; Li, Changxuan

    Journal: IEEE OPEN JOURNAL OF THE INDUSTRIAL ELECTRONICS SOCIETY. 2026; Vol. 7, Issue , pp. 157-172. DOI: 10.1109/OJIES.2025.3647204