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A compact broadband high power quasi-MMIC GaN power amplifier
Author: Liu, Lin-sheng; Lin, Qian; Wu, Hai-Feng; Chen, Yi-Jun; Hu, Liu-Lin
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 2, pp. 167-173. DOI: 10.1108/CW-07-2020-0157
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A self-powered ultra-low-power intermittent-control SSHI circuit for piezoelectric energy harvesting
Author: Wang, Guoda; Li, Ping; Wen, Yumei; Luo, Zhichun
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 2, pp. 138-144. DOI: 10.1108/CW-11-2020-0320
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Effects of additives on via filling and pattern plating with simultaneous electroplating
Author: Sun, Zhihong; Wang, Jing
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 2, pp. 105-112. DOI: 10.1108/CW-12-2020-0335
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Analysis, design and experimentation of high-pass negative group delay lumped circuit
Author: Du, Hongyu; Yang, Rong; Gu, Taochen; Zhou, Xiang; Yazdani, Samar; Sambatra, Eric; Wan, Fayu; Lallechere, Sebastien; Ravelo, Blaise
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 2, pp. 180-191. DOI: 10.1108/CW-07-2020-0131
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Study on load monitoring and demand side management strategy based on Elman neural network optimized by sparrow search algorithm
Author: Fan, Yuanyuan; Sui, Tingyu; Peng, Kang; Sang, Yingjun; Huang, Fei
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 1, pp. 56-66. DOI: 10.1108/CW-07-2021-0199
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Design and fabrication of rotary magnetostrictvie energy harvester for knee-joint wearable applications
Author: Yan, Baiping; Huang, Dazhuo; Hong, Junjie; Zhang, Chengming
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 1, pp. 67-79. DOI: 10.1108/CW-01-2021-0002
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Modeling and characterization of capacitor storage circuit for piezoelectric vibration energy harvester
Author: Wei, Sheng
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 1, pp. 80-89. DOI: 10.1108/CW-02-2020-0018
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Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching
Author: Fu, Denglin; Wen, Yanan; Chen, Jida; Lu, Lansi; Yan, Ting; Liao, Chaohui; He, Wei; Chen, Shijin; Sheng, Lizhao
Journal: CIRCUIT WORLD. 2023; Vol. 49, Issue 1, pp. 1-12. DOI: 10.1108/CW-05-2019-0047
