Ieee Transactions On Reliability

Ieee Transactions On Reliability

可靠性交易

  • 2区 中科院分区
  • Q1 JCR分区

期刊简介

《Ieee Transactions On Reliability》是由Institute of Electrical and Electronics Engineers Inc.出版社于1963年创办的英文国际期刊(ISSN: 0018-9529,E-ISSN: 1558-1721),该期刊长期致力于计算机:硬件领域的创新研究,主要研究方向为工程技术-工程:电子与电气。作为SCIE收录期刊(JCR分区 Q1,中科院 2区),本刊采用OA未开放获取模式(OA占比0%),以发表计算机:硬件领域等方向的原创性研究为核心(研究类文章占比98.48%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在132篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动计算机科学领域高水平交流平台。

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投稿提示

Ieee Transactions On Reliability审稿周期约为 约4.5个月 。该刊近年未被列入国际预警名单,年发文量约132篇,录用竞争适中,主题需确保紧密契合计算机科学前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 计算机科学 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 132 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
计算机科学
2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区 2区 2区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
计算机科学
2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区 2区 2区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q1 8 / 59

87.3%

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 13 / 131

90.5%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 65 / 352

81.7%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q1 7 / 59

88.98%

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 14 / 131

89.69%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 42 / 354

88.28%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:12.2 SJR:1.511 SNIP:1.989
学科类别 分区 排名 百分位
大类:Engineering 小类:Safety, Risk, Reliability and Quality Q1 7 / 207

96%

大类:Engineering 小类:Electrical and Electronic Engineering Q1 57 / 797

92%

期刊发文

  • Novel Discriminant Locality Preserving Projection Integrated With Monte Carlo Sampling for Fault Diagnosis

    Author: He, Yan-Lin; Li, Kun; Liang, Li-Long; Xu, Yuan; Zhu, Qun-Xiong

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 166-176. DOI: 10.1109/TR.2021.3115108

  • Fault Diagnosability of Networks With Fault-Free Block at Local Vertex Under MM* Model

    Author: Huang, Yanze; Lin, Limei; Lin, Yuhang; Xu, Li; Hsieh, Sun-Yuan

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 372-383. DOI: 10.1109/TR.2021.3129257

  • Improved Locality Preserving Projections Based on Heat-Kernel and Cosine Weights for Fault Classification in Complex Industrial Processes

    Author: Zhang, Ning; Xu, Yuan; Zhu, Qun-Xiong; He, Yan-Lin

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 204-213. DOI: 10.1109/TR.2021.3139539

  • Resilience Enhancement for Multistate Interdependent Infrastructure Networks: From a Preparedness Perspective

    Author: Wang, Kai; Xu, Zhaoping; Liu, Yu; Fang, Yiping

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 190-203. DOI: 10.1109/TR.2021.3132774

  • SeTransformer: A Transformer-Based Code Semantic Parser for Code Comment Generation

    Author: Li, Zheng; Wu, Yonghao; Peng, Bin; Chen, Xiang; Sun, Zeyu; Liu, Yong; Paul, Doyle

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 258-273. DOI: 10.1109/TR.2022.3154773

  • Reliability of a Distributed Data Storage System Considering the External Impacts

    Author: Kou, Gang; Yi, Kunxiang; Xiao, Hui; Peng, Rui

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 3-14. DOI: 10.1109/TR.2022.3161638

  • Reliability Modeling and Assessment for a Cyber-Physical System With a Complex Boundary Behavior

    Author: Gong, Hongfang; Li, Renfa; An, Jiyao; Xie, Guoqi

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 224-239. DOI: 10.1109/TR.2022.3160460

  • An Intelligent Resource Management Solution for Hospital Information System Based on Cloud Computing Platform

    Author: Gong, Siqian; Zhu, Xiaomin; Zhang, Runtong; Zhao, Hongmei; Guo, Chao

    Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 329-342. DOI: 10.1109/TR.2022.3161359