Materials Science In Semiconductor Processing

Materials Science In Semiconductor Processing

半导体加工中的材料科学

  • 3区 中科院分区
  • Q2 JCR分区

期刊简介

《Materials Science In Semiconductor Processing》是由Elsevier Ltd出版社于1998年创办的英文国际期刊(ISSN: 1369-8001,E-ISSN: 1873-4081),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为工程技术-材料科学:综合。作为SCIE收录期刊(JCR分区 Q2,中科院 3区),本刊采用OA未开放获取模式(OA占比0.0123...%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比96.22%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在635篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

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投稿提示

Materials Science In Semiconductor Processing审稿周期约为 约1.7个月 约3.7周。该刊近年未被列入国际预警名单,年发文量约635篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 635 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 PHYSICS, APPLIED 物理:应用 PHYSICS, CONDENSED MATTER 物理:凝聚态物理
3区 3区 3区 3区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
PHYSICS, APPLIED 物理:应用 PHYSICS, CONDENSED MATTER 物理:凝聚态物理 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合
2区 2区 3区 3区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 89 / 352

74.9%

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q2 158 / 438

64%

学科:PHYSICS, APPLIED SCIE Q2 51 / 179

71.8%

学科:PHYSICS, CONDENSED MATTER SCIE Q2 25 / 79

69%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 113 / 354

68.22%

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q2 125 / 438

71.58%

学科:PHYSICS, APPLIED SCIE Q2 47 / 179

74.02%

学科:PHYSICS, CONDENSED MATTER SCIE Q1 19 / 79

76.58%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:8 SJR:0.732 SNIP:0.992
学科类别 分区 排名 百分位
大类:Engineering 小类:Mechanical Engineering Q1 87 / 672

87%

大类:Engineering 小类:Condensed Matter Physics Q1 59 / 434

86%

大类:Engineering 小类:Mechanics of Materials Q1 60 / 398

85%

大类:Engineering 小类:General Materials Science Q1 100 / 463

78%

期刊发文

  • V2O5 nanobelts via a facile water-assisted strategy boosting electrochromic performance

    Author: Sun, Haohao; Wang, Wenxuan; Fan, Qiongzhen; Qi, Yanyuan; Xiong, Yuli; Jian, Zelang; Chen, Wen

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 155, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107265

  • Ag/Ag3PO4 nanoparticles assembled on sepiolite nanofibers: Enhanced visible-light-driven photocatalysis and the important role of Ag decoration

    Author: Ren, Xiaofei; Hu, Guicong; Guo, Qingbin; Gao, Dengzheng; Wang, Li; Hu, Xiaolong

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107272

  • Exploring the effect of oxygen environment on the Mo/CdTe/CdSe solar cell substrate configuration

    Author: Yang, Xiutao; Long, Yuchen; Zheng, Yujie; Wang, Jiayi; Zhou, Biao; Xie, Shenghui; Li, Bing; Zhang, Jingquan; Hao, Xia; Karazhanov, Smagul; Zeng, Guanggen; Feng, Lianghuan

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107267

  • Slag refining at various viscosity conditions for SiC inclusion removal during Si scraps recycling

    Author: Pan, Di; Jiang, Dachuan; Hu, Zhiqiang; Li, Pengting; Tan, Yi; Li, Jin; Li, Jiayan

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107274

  • Fabrication of interface-engineered Ni/NiO/rGO nanobush for highly efficient and durable oxygen reduction

    Author: Wang, Yanan; Duan, Chunyang; Li, Junhua; Zhao, Zenghua; Xu, Jiasheng; Liu, Lin; Qian, Jianhua

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107259

  • The structural, mechanical and electronic properties of BaxNy compounds

    Author: Wang, Gao-Min; Zeng, Wei; Zhang, Fan; Li, Xing-Han; Liu, Fu-Sheng; Tang, Bin; Zhong, Mi; Liu, Qi-Jun

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107268

  • Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium- based copper interconnected and the surface action mechanism analysis

    Author: Luo, Fu; Niu, Xinhuan; Yan, Han; Zhang, Yinchan; Qu, Minghui; Zhu, Yebo; Hou, Ziyang

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107276

  • Hyperspectral camouflage coating using Palygorskite to simulate water absorption of healthy green leaves

    Author: Lu, Haipeng; Bai, Xingzhi; Wang, Zhenxiong; Guo, Yang; Zhang, Li; Weng, Xiaolong; Xie, Jianliang; Liang, Difei; Deng, Longjiang

    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107293