Computers & Electrical Engineering

Computers & Electrical Engineering

计算机与电气工程

  • 3区 中科院分区
  • Q1 JCR分区

期刊简介

《Computers & Electrical Engineering》是由Elsevier Ltd出版社于1973年创办的英文国际期刊(ISSN: 0045-7906,E-ISSN: 1879-0755),该期刊长期致力于计算机:硬件领域的创新研究,主要研究方向为工程技术-工程:电子与电气。作为SCIE收录期刊(JCR分区 Q1,中科院 3区),本刊采用OA未开放获取模式(OA占比0.0047...%),以发表计算机:硬件领域等方向的原创性研究为核心(研究类文章占比98.74%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在398篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动计算机科学领域高水平交流平台。

投稿咨询

投稿提示

Computers & Electrical Engineering审稿周期约为约8.9 weeks 约12.0个月 。该刊近年未被列入国际预警名单,年发文量约398篇,录用竞争适中,主题需确保紧密契合计算机科学前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 计算机科学 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 398 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
计算机科学
3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区 3区 3区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
计算机科学
3区
COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区 3区 3区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q1 11 / 59

82.2%

学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q2 45 / 169

73.7%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 100 / 352

71.7%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 16 / 59

73.73%

学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q2 49 / 169

71.3%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 99 / 354

72.18%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:9.2 SJR:1.041 SNIP:1.395
学科类别 分区 排名 百分位
大类:Engineering 小类:Control and Systems Engineering Q1 43 / 321

86%

大类:Engineering 小类:Electrical and Electronic Engineering Q1 111 / 797

86%

大类:Engineering 小类:General Computer Science Q1 33 / 232

85%

期刊发文

  • Automatic 1p/19q co-deletion identification of gliomas by MRI using deep learning U-net network

    Author: Zhao, Kai; Li, Boyuan; Zhang, Kai; Liu, Ruoyu; Gao, Long; Shu, Xujun; Liu, Minghang; Yang, Xuejun; Chen, Shengbo; Sun, Guochen

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108482

  • Heatmap and edge guidance network for salient object detection

    Author: Zhang, Botong; Tian, Lihua; Li, Chen; Yang, Yi

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108525

  • A deep learning approach to secure vehicle to road side unit communications in intelligent transportation system

    Author: Wu, Yun; Wu, Liangshun; Cai, Hengjin

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108542

  • Domain adaptation based on feature fusion and multi-attention mechanism*

    Author: Wang, Tiansheng; Liu, Zhonghua; Ou, Weihua; Huo, Hua

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 108, Issue , pp. -. DOI: 10.1016/j.compeleceng.2023.108726

  • Market behavior-oriented deep learning-based secure data analysis in smart cities

    Author: Lv, Qiuying; Yang, Nannan; Slowik, Adam; Lv, Jianhui; Yousefpour, Amin

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 108, Issue , pp. -. DOI: 10.1016/j.compeleceng.2023.108722

  • Taxi travel time prediction based on fusion of traffic condition features

    Author: Sheng, Zhaoyu; Lv, Zhiqiang; Li, Jianbo; Xu, Zhihao; Sun, Haokai; Liu, Xue; Ye, Rongkun

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108530

  • PET-CT image Co-segmentation of lung tumor using joint level set model

    Author: Chen, Zhe; Qiu, Nan; Feng, Hui; Dai, Dongfang

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108545

  • VStyclone: Real-time Chinese voice style clone

    Author: Wu, Yichun; Zhao, Huihuang; Liang, Xiaoman; Sun, Yaqi

    Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108534