Ieee Transactions On Very Large Scale Integration (vlsi) Systems

Ieee Transactions On Very Large Scale Integration (vlsi) Systems

超大规模集成 (vlsi) 系统上的 Ieee 事务

  • 2区 中科院分区
  • Q2 JCR分区

期刊简介

《Ieee Transactions On Very Large Scale Integration (vlsi) Systems》是由Institute of Electrical and Electronics Engineers Inc.出版社于1993年创办的英文国际期刊(ISSN: 1063-8210,E-ISSN: 1557-9999),该期刊长期致力于计算机:硬件领域的创新研究,主要研究方向为工程技术-工程:电子与电气。作为SCIE收录期刊(JCR分区 Q2,中科院 2区),本刊采用OA未开放获取模式(OA占比0%),以发表计算机:硬件领域等方向的原创性研究为核心(研究类文章占比99.59%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在241篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

投稿咨询

投稿提示

Ieee Transactions On Very Large Scale Integration (vlsi) Systems审稿周期约为 一般,3-6周 。该刊近年未被列入国际预警名单,年发文量约241篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 241 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区 3区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区 3区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 23 / 59

61.9%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 151 / 352

57.2%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 26 / 59

56.78%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 149 / 354

58.05%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:6.4 SJR:0.937 SNIP:1.516
学科类别 分区 排名 百分位
大类:Engineering 小类:Electrical and Electronic Engineering Q1 195 / 797

75%

大类:Engineering 小类:Hardware and Architecture Q2 51 / 177

71%

大类:Engineering 小类:Software Q2 124 / 407

69%

期刊发文

  • A Low-Cost Reduced-Latency DRAM Architecture With Dynamic Reconfiguration of Row Decoder

    Author: Bai, Fujun; Wang, Song; Jia, Xuerong; Guo, Yixin; Yu, Bing; Wang, Hang; Lai, Cong; Ren, Qiwei; Sun, Hongbin

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 128-141. DOI: 10.1109/TVLSI.2022.3219437

  • A Security-Enhanced, Charge-Pump-Free, ISO14443-A-/ISO10373-6-Compliant RFID Tag With 16.2-mu W Embedded RRAM and Reconfigurable Strong PUF

    Author: Ren, Qirui; Huo, Qiang; Chen, Zhisheng; Gao, Qi; Wang, Yiming; Yang, Yiming; Wu, Hao; Fu, Xiangqu; Xu, Xiaoxin; Luo, Qing; Gao, Jianfeng; Chen, Chengying; Zhao, Xiaojin; Lei, Dengyun; Wang, Xinghua; Zhang, Feng; Chen, Yong; Mak, Pui-In

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 243-252. DOI: 10.1109/TVLSI.2022.3222522

  • A 4.5-W, 18.5-24.5-GHz GaN Power Amplifier Employing Chebyshev Matching Technique

    Author: Wang, Yujia; Zhang, Jincheng; Chen, Yong; Ren, Junyan; Ma, Shunli

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 233-242. DOI: 10.1109/TVLSI.2022.3225967

  • Fast Estimation of a Statistical Eye Diagram for Nonlinear High-Speed Links Based on the Minimum Required Order of the Multiple Edge Response Method

    Author: Wang, Jun; Luo, Yuhuan; Guo, Wenting; Wu, Feng; Chu, Xiuqin

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 210-218. DOI: 10.1109/TVLSI.2022.3225533

  • Multiple-Mode-Supporting Floating-Point FMA Unit for Deep Learning Processors

    Author: Tan, Hongbing; Tong, Gan; Huang, Libo; Xiao, Liquan; Xiao, Nong

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 253-266. DOI: 10.1109/TVLSI.2022.3226185

  • A High-Speed Low-Noise Comparator With Auxiliary-Inverter-Based Common Mode-Self-Regulation for Low-Supply-Voltage SAR ADCs

    Author: Qiu, Lei; Meng, Tianyi; Yao, Bingbing; Du, Zihao; Yuan, Xiaohua

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 152-156. DOI: 10.1109/TVLSI.2022.3224237

  • BitXpro: Regularity-Aware Hardware Runtime Pruning for Deep Neural Networks

    Author: Li, Hongyan; Lu, Hang; Wang, Haoxuan; Deng, Shengji; Li, Xiaowei

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 90-103. DOI: 10.1109/TVLSI.2022.3221732

  • Reliability Evaluation and Fault Tolerance Design for FPGA Implemented Reed Solomon (RS) Erasure Decoders

    Author: Gao, Zhen; Shi, Jinchang; Liu, Qiang; Ullah, Anees; Reviriego, Pedro

    Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 142-146. DOI: 10.1109/TVLSI.2022.3224137