Journal Of Micromechanics And Microengineering投稿须知

期刊简介

《Journal Of Micromechanics And Microengineering》是由IOP Publishing Ltd.出版社于1991年创办的英文国际期刊（ISSN: 0960-1317，E-ISSN: 1361-6439），该期刊长期致力于工程：电子与电气领域的创新研究，主要研究方向为工程技术-材料科学：综合。作为SCIE收录期刊（JCR分区 Q2，中科院 4区），本刊采用OA未开放获取模式（OA占比0.0241...%），以发表工程：电子与电气领域等方向的原创性研究为核心（研究类文章占比95.62%%）。凭借严格的同行评审与高效编辑流程，期刊年载文量精选控制在137篇，确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库，为学者提供推动工程技术领域高水平交流平台。

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Journal Of Micromechanics And Microengineering审稿周期约为约2.8个月。该刊近年未被列入国际预警名单，年发文量约137篇，录用竞争适中，主题需确保紧密契合工程技术前沿。投稿策略提示：避开学术会议旺季投稿以缩短周期，语言建议专业润色提升可读性。

工程技术 大类学科
English 出版语言
否是否预警
SCIE 期刊收录
137 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊	综述期刊	大类学科	小类学科
否	否	工程技术 4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 INSTRUMENTS & INSTRUMENTATION 仪器仪表 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用 4区 4区 4区 4区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊	综述期刊	大类学科	小类学科
否	否	工程技术 4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 INSTRUMENTS & INSTRUMENTATION 仪器仪表 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用 4区 4区 4区 4区

JCR分区

按JIF指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	170 / 352	51.8%
学科：INSTRUMENTS & INSTRUMENTATION	SCIE	Q2	29 / 76	62.5%
学科：NANOSCIENCE & NANOTECHNOLOGY	SCIE	Q3	102 / 140	27.5%
学科：PHYSICS, APPLIED	SCIE	Q3	96 / 179	46.6%

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	200 / 354	43.64%
学科：INSTRUMENTS & INSTRUMENTATION	SCIE	Q3	46 / 76	40.13%
学科：NANOSCIENCE & NANOTECHNOLOGY	SCIE	Q3	82 / 140	41.79%
学科：PHYSICS, APPLIED	SCIE	Q3	106 / 179	41.06%

CiteScore

SJR

SNIP

CiteScore 排名

CiteScore：4.5

SJR：0.476

SNIP：0.789

学科类别	分区	排名	百分位
大类：Engineering 小类：Mechanical Engineering	Q2	207 / 672	69%
大类：Engineering 小类：Mechanics of Materials	Q2	146 / 398	63%
大类：Engineering 小类：Electrical and Electronic Engineering	Q2	292 / 797	63%
大类：Engineering 小类：Electronic, Optical and Magnetic Materials	Q2	118 / 284	58%

期刊发文

Loss mechanisms of multi-frequency whispering gallery mode RF-MEMS resonators
Author: Liu, Wenli; Chen, Zeji; Lu, Yujie; Zhao, Junyuan; Zhu, Yinfang; Yang, Jinling; Yang, Fuhua

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/ac8bde
Remote actuation based on magnetically responsive pillar arrays
Author: Jiang, Wei; Wang, Lanlan; Chen, Bangdao; Liu, Hongzhong

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/aca20f
Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors
Author: Zhang, Yunfan; Wu, Kangkang; Shen, Shengnan; Zhang, Quanyong; Cao, Wan; Liu, Sheng

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca913
Topology optimization design of compliant amplification mechanisms with low parasitic displacement
Author: Wang, Qiliang; Wei, Jianming; Long, Yiping; Tan, Jianping

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca4dc
An ionic pressure sensor array with digitizable sensitivity
Author: Zou, Qiang; Liu, Chenyu; Su, Qi; Xue, Tao

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc873
Identification and suppression of driving force misalignment angle for a MEMS gyroscope using parametric excitation
Author: Zheng, Xudong; Wang, Xuetong; Shen, Yaojie; Xia, Chenhao; Tong, Wenyuan; Jin, Zhonghe; Ma, Zhipeng

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc6
Research on high temperature performance of pressure sensor
Author: Zhao, Zhiqiang; Pan, Shuliang; Memon, Maria Muzamil; Liu, Qiong; Wang, Tao; Zhang, Wanli

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc6dd
Developing a multi-sample acoustofluidic device for high-throughput cell aggregation
Author: Yang, Renhua; Huang, Siping; Zhang, Yiwen; Zhang, Chao; Qian, Jingui; Lam, Raymond H. W.; Lee, Joshua E-Y; Wang, Zuankai

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc5

Journal Of Micromechanics And Microengineering

微机械与微工程杂志

期刊简介

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中科院分区

JCR分区

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