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MEMS Microheater With Fast Electrothermal Response for Self-Destructing Chip Application
Author: He, Haoran; Ma, Wanli; Fan, Zhiqiang; Xu, Kai; Kang, Zhiqiang; Zhao, Wei; Zhang, Le; Qiao, Xiaojun; Geng, Wenping
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3674741
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A Novel Comprehensive Parametric Macromodeling Method for MEMS Sensors Based on the Reduced-Order State-Space Models and Machine Learning Approache
Author: Xu, Hao; Mo, Yun-Cong; Zhang, Hao-Dong; Wen, Jun-Jie; Zhou, Zai-Fa; Huang, Qing-An
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3677815
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A Nano-g MEMS Accelerometer With Electrostatic Anti-Spring Based on SOI Technolog
Author: Cao, Jianxia; Cao, Kangda; Zhou, Yang; Pei, Zhe; Ouyang, Hao; Zhao, Kunwei; Zhang, Shaolin; Yu, Kan; Wu, Wenjie; Liu, Huafeng; Liu, Jinquan
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3676738
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Analysis of Brittle Fracture Characteristics Under Static/Dynamic Loads in Silicon-Based MEMS Cantilever
Author: Yang, Mo; Cheng, Baolin; Nie, Weirong; Shi, Mingyuyi; Lei, Shenghong; Wang, He; Dai, Shijuan; Cao, Yun
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3679568
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A Novel Optimization and Yield Analysis Method for MEMS Devices Combining Bi-Fidelity Deep Neural Network and Active Subspac
Author: Zhao, Lin-Feng; Liu, Gong-Zeng; Mo, Yun-Cong; Wang, He; Huang, Qing-An; Zhou, Zai-Fa
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3667598
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Low-Loss and Ultra-Wideband SAW Filters Using LiNbO3/Si Structur
Author: Xu, Qiufeng; Shen, Junyao; Xie, Shouren; Shen, Quhuan; Pan, Feng
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3669513
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A Lithium Niobate Piezoelectric Micromachined Ultrasonic Transducer Operating in Thickness-Field-Excitation ModeWith Enhanced Acoustic Emissio
Author: Liu, Zhiquan; Le, Xianhao; Wang, Xiongfeng; Jiang, Yang; Wan, Qing; Xu, Wei; Mao, Junfa; Liao, Wugang; Gao, Feng
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3668053
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Two-Dimensional Modeling for Parametric Optimization and Crosstalk Analysis of Dual-Axis Micro Thermal Convective Tilt Sensor
Author: Luo, Huahuang; Peng, Tingfeng; Lu, Zihan; Xu, Hongxin; Wang, Yuan; Kraft, Michael; Wang, Chen; Ke, Qingqing
Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3672086
