Ieee Transactions On Circuits And Systems I-regular Papers

Ieee Transactions On Circuits And Systems I-regular Papers

IEEE Transactions On Circuits And Systems I-常规论文

  • 1区 中科院分区
  • Q1 JCR分区

期刊简介

《Ieee Transactions On Circuits And Systems I-regular Papers》是由Institute of Electrical and Electronics Engineers Inc.出版社于1992年创办的英文国际期刊(ISSN: 1549-8328,E-ISSN: 1558-0806),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为工程技术-工程:电子与电气。作为SCIE收录期刊(JCR分区 Q1,中科院 1区),本刊采用OA未开放获取模式(OA占比0%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比99.59%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在488篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

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投稿提示

Ieee Transactions On Circuits And Systems I-regular Papers审稿周期约为 一般,3-6周 。该刊近年未被列入国际预警名单,年发文量约488篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 488 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
1区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 61 / 352

82.8%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 70 / 354

80.37%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:9.8 SJR:1.836 SNIP:1.9
学科类别 分区 排名 百分位
大类:Engineering 小类:Electrical and Electronic Engineering Q1 99 / 797

87%

大类:Engineering 小类:Hardware and Architecture Q1 24 / 177

86%

期刊发文

  • SAMBA: Single-ADC Multi-Bit Accumulation Compute-in-Memory Using Nonlinearity-Compensated Fully Parallel Analog Adder Tree

    Author: Chen, Yiming; Yin, Guodong; Zhou, Mufeng; Tang, Wenjun; Yang, Zekun; Lee, Mingyen; Du, Xirui; Yue, Jinshan; Liu, Jiaxin; Yang, Huazhong; Liu, Yongpan; Li, Xueqing

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. , Issue , pp. -. DOI: 10.1109/TCSI.2023.3266269

  • Balanced Filtering Phase Shifters With Low Phase Deviation and High Common-Mode Suppression

    Author: Wei, Feng; Ding, Xue-Zhi; Liu, Xinxin; Liu, Bo; Li, Zhao; Zhao, Xi-Bei

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. , Issue , pp. -. DOI: 10.1109/TCSI.2023.3265085

  • Hierarchical Prescribed-Time Coordination for Multiple Lagrangian Systems With Input-to-Output Redundancy and Matrix-Weighted Networks

    Author: Zhao, Xiao-Feng; Han, Tao; Guan, Zhi-Hong; Xiao, Bo; Yan, Huaicheng; Ge, Yuan

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. 70, Issue 1, pp. 447-459. DOI: 10.1109/TCSI.2022.3208189

  • Consensus of Nonlinear Multiagent Systems With Uncertainties Using Reinforcement Learning Based Sliding Mode Control

    Author: Li, Jinna; Yuan, Lin; Chai, Tianyou; Lewis, Frank L.

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. 70, Issue 1, pp. 424-434. DOI: 10.1109/TCSI.2022.3206102

  • A High-Speed FPGA-Based Hardware Implementation for Leighton-Micali Signature

    Author: Song, Yifeng; Hu, Xiao; Tian, Jing; Wang, Zhongfeng

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. 70, Issue 1, pp. 241-252. DOI: 10.1109/TCSI.2022.3210016

  • Stability Conditions for Cluster Synchronization in Directed Networks of Diffusively Coupled Nonlinear Systems

    Author: Zhai, Shidong; Zheng, Wei Xing

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. 70, Issue 1, pp. 413-423. DOI: 10.1109/TCSI.2022.3208000

  • LMI-Based Determination of the Peak of the Response of Structured Polytopic Linear Systems

    Author: Chesi, Graziano; Shen, Tiantian

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. 70, Issue 1, pp. 435-446. DOI: 10.1109/TCSI.2022.3210934

  • A Hybrid Single-Inductor Bipolar Triple-Output DC-DC Converter With High-Quality Positive Outputs for AMOLED Displays

    Author: Mao, Fangyu; Lu, Yan; Maloberti, Franco; Martins, Rui P.

    Journal: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS. 2023; Vol. 70, Issue 1, pp. 506-517. DOI: 10.1109/TCSI.2022.3211100