-
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times
Author: Zhang, Xiangou; Wang, Yuexing; Sun, Xiangyu; Deng, Zejia; Pu, Yingdong; Zhang, Ping; Huang, Zhiyong; Zhou, Quanfeng
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. , Issue , pp. -. DOI: 10.1108/MI-12-2022-0203
-
Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications
Author: Xiao, Yuchen; Tang, Huiyi; Zhang, Hehe; Yang, Xiaoling; Sun, Ling; Xie, Yong; Wu, Baoan; Luan, Baifeng; Xie, Weidong; Cai, Xinnan
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. 40, Issue 2, pp. 96-103. DOI: 10.1108/MI-08-2022-0158
-
Effects of Co-60 gamma ray radiation on the transmission characteristics of interconnection structures for 3D packaging
Author: Zhang, Youxin; Liu, Yang; Gao, Rongxing; Zeng, Xianghua; Xue, Yuxiong
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. 40, Issue 2, pp. 109-114. DOI: 10.1108/MI-07-2022-0120
-
W-band antenna in package module with hybrid glass-compound WLFO process
Author: Wang, Gang; Xia, Chenhui; Wang, Bo; Zhao, Xinran; Li, Yang; Yang, Ning
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. 40, Issue 2, pp. 104-108. DOI: 10.1108/MI-06-2022-0111
-
Magnetic alignment technology for wafer bonding
Author: Ye, Lezhi; Song, Xuanjie; Yue, Chang
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. , Issue , pp. -. DOI: 10.1108/MI-08-2022-0160
-
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration
Author: Li, Ge; Kang, Qiushi; Niu, Fanfan; Wang, Chenxi
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. 40, Issue 2, pp. 115-131. DOI: 10.1108/MI-07-2022-0121
-
Effects of interface cracks on reliability of surface mount technology interconnection in service environment
Author: Liu, Shaoyi; Yao, Songjie; Xue, Song; Wang, Benben; Jin, Hui; Pan, Chenghui; Zhang, Yinwei; Zhou, Yijiang; Zeng, Rui; Ping, Lihao; Min, Zhixian; Zhang, Daxing; Wang, Congsi
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. 40, Issue 2, pp. 140-151. DOI: 10.1108/MI-10-2022-0183
-
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles
Author: Li, Liyun; Zhang, Yu; Xia, Shiyu; Sun, Zhefei; Yuan, Junjie; Su, Dongchuan; Cao, Hunjun; Chai, Xiaoming; Wang, Qingtian; Li, Jintang; Zhang, Zhihao
Journal: MICROELECTRONICS INTERNATIONAL. 2023; Vol. 40, Issue 2, pp. 132-139. DOI: 10.1108/MI-11-2022-0186
