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Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics couplin
Author: Wang, Yuqi; Yao, Ran; Li, Hui; Lai, Wei; Yuan, Wenqian; Ji, Yirun; Huai, Qing; Yuan, Xi; Jie, Ziyao
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. 43, Issue 2, pp. 38-50. DOI: 10.1108/MI-08-2025-0164
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Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguid
Author: Zhang, Tao; Zou, Danqing; Meng, Fan-Yi; Wang, Yuxin; Sun, Hongpeng; Fu, Jia-Hui; Ding, Chang
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-07-2025-0129
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Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joint
Author: Liu, Yun-Xin; Zhang, Liang; Chen, Yu-Hao; Zhang, Jia-Min; Chen, Mo; Liu, Tao; Shi, Lei
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-12-2025-0267
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Stress-strain analysis and morphological parameter optimization of CSP solder joints under coupled tensile and shear loadin
Author: Liu, Xiaobin; Huang, Chunyue; Yang, Jinmei
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-11-2025-0231
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Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorith
Author: Liu, Xianjia; Huang, Long; Huang, Chunyue; Chen, Yonglin; Liang, Ying; Gao, Chao; Wu, Liye; Cao, Zhiqin
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-07-2025-0130
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Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedbac
Author: Jiang, Kezheng; Ao, Yuqi; Zhao, Yifan; Xiong, Ping; Ding, Hao; Zhou, Yi
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-07-2025-0123
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Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling load
Author: Yang, Xuexia; Zhu, Miao; Sun, Yanxi; Lin, Jinbao; Hao, Xin; Shu, Xuefeng; Xiao, Gesheng
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-06-2025-0120
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Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind powe
Author: Wang, Yanfeng; Peng, Sui; Fu, Yan; He, Lingfeng; Huang, Jun; Yang, Lingyun; Huang, Zhicong
Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-06-2025-0105
