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Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder
Author: Xu, Fengxian; Zhu, Wenjia; Yan, Jikang; Zhao, Lingyan; Lv, Jinmei
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 140, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114883
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Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation
Author: Xiang, Meiju; Wang, Duowei; He, Mu; Rui, Guo; Ma, Yao; Zhu, Xuhao; Mei, Fan; Gong, Min; Li, Yun; Huang, Mingmin; Yang, Zhimei
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114886
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Small sample classification based on data enhancement and its application in flip chip defection
Author: Sha, Yuhua; He, Zhenzhi; Gutierrez, Hector; Du, Jiawei; Yang, Weiwei; Lu, Xiangning
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114887
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BP neural network for non-invasive IGBT junction temperature online detection
Author: Liu, Li; Peng, Qianlei; Jiang, Huaping; Ran, Li; Wang, Yang; Du, Changhong; Chen, Jian; Zhou, Hongbo; Chen, Yang; Peng, Zhiyuan
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114882
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Thermal stress and drop stress analysis based on 3D package reliability study
Author: Xue, Leyang; Li, Xiang; Zhang, Hao
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114888
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Study on the interface mechanism of copper migration failure in solder mask-substrate package
Author: Li, Yesu; Lin, Shengru; Chi, Panwang; Zou, Yuqiang; Yao, Weikai; Li, Ming; Gao, Liming
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114891
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Effect of temperature cycling on the leakage mechanism of TSV liner
Author: Chen, Si; Jian, Xiaodong; Li, Kai; Li, Guoyuan; Wang, Zhizhe; Yang, Xiaofeng; Fu, Zhiwei; Wang, Hongyue
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114889
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Simulation analysis of electromagnetic pulse susceptibility and hardening design for system-in-package SZ0501
Author: Li, Ning; Li, Yang; Guo, Yaxin; He, Chaohui
Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114892
