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Research on packaging damage and final failure of large-scale plastic-encapsulated power module under thermal stres
Author: Zhu, Zhanshan; Zhang, Yuexin; Cao, Yang; Cui, Dingyuan; Xiao, Jianxiang; Xu, Min
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116112
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An analytical-numerical thermal modeling method for multilayer PCBs including lateral surface heat transfe
Author: Zhang, Yabin; Chen, Lin; Luo, Shenyuan
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116120
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Thermal reliability of 2D materials integrated with silicon-based CMOS ICs and analysis under complex condition
Author: Huang, Jinfeng; Ye, Yuxin; Malik, Muhammad; Anwar, Muhammad Abid; Liu, Guanyu; Zhao, Yuda; Ma, Hanzhi; Yu, Bin; Xu, Yang
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116123
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Research on evaluation methods of total ionizing radiation on SiC MOSFETs with various dose rates and temperature
Author: Zhang, Dan; Shi, Chengcheng; Liang, Xiaowen; Wei, Ying; Wen, Lin; Song, Yu; Feng, Jie; Yu, Xuefeng; Zhou, Dong; Guo, Qi; Wang, Bo; Li, Yudong
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116126
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Influence of bonding wire on insulation characteristics of chip termination in high-voltage power electronic device
Author: Qi, Zhaoyuan; Li, Xuebao; Liu, Zhaocheng; Cai, Yumeng; Zheng, Chao; Zhao, Yushan; Sun, Peng; Zhao, Zhibin
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116080
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Microstructural evolution and mechanical performance of transient liquid phase bonded Ni/Cu foam (Sn-infiltrated)/Ni joint
Author: Pan, Zhen; Wang, Zhihui; Deng, Chaohan; Lian, Xiangyu; Chi, Hongmei
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116122
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Method for geometric correction of indentation hardness on curved surfaces: Implications for solder joint structure
Author: Xu, Yukun; Song, Shaowei; Li, Xiaozhen; Liu, Haodong; Zhang, Weixu
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116127
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Design of high failure current embedded dual direction SCR with segmented topology for high-voltage ESD protectio
Author: Xiao, Tao; Yang, Hongjiao; Wang, Yang; Tang, Zhengdong; Wang, Yitao; Chen, Yujie
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116117
