Microprocessors And Microsystems

Microprocessors And Microsystems

微处理器和微系统

  • 4区 中科院分区
  • Q2 JCR分区

期刊简介

《Microprocessors And Microsystems》是由Elsevier出版社于1978年创办的英文国际期刊(ISSN: 0141-9331,E-ISSN: 1872-9436),该期刊长期致力于计算机:硬件领域的创新研究,主要研究方向为工程技术-工程:电子与电气。作为SCIE收录期刊(JCR分区 Q2,中科院 4区),本刊采用OA未开放获取模式(OA占比0.0147...%),以发表计算机:硬件领域等方向的原创性研究为核心(研究类文章占比96.55%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在145篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动计算机科学领域高水平交流平台。

投稿咨询

投稿提示

Microprocessors And Microsystems审稿周期约为 较慢,6-12周 。该刊近年被列入国际预警名单,年发文量约145篇,录用竞争适中,主题需确保紧密契合计算机科学前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 计算机科学 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 145 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
计算机科学
4区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, THEORY & METHODS 计算机:理论方法 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
4区 4区 4区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
计算机科学
3区
COMPUTER SCIENCE, THEORY & METHODS 计算机:理论方法 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件
3区 3区 4区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 42 / 59

29.7%

学科:COMPUTER SCIENCE, THEORY & METHODS SCIE Q2 60 / 143

58.4%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 211 / 352

40.2%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 32 / 59

46.61%

学科:COMPUTER SCIENCE, THEORY & METHODS SCIE Q2 67 / 143

53.5%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 179 / 354

49.58%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:6.9 SJR:0.549 SNIP:1.003
学科类别 分区 排名 百分位
大类:Computer Science 小类:Computer Networks and Communications Q1 93 / 395

76%

大类:Computer Science 小类:Hardware and Architecture Q2 45 / 177

74%

大类:Computer Science 小类:Software Q2 109 / 407

73%

大类:Computer Science 小类:Artificial Intelligence Q2 108 / 350

69%

期刊发文

  • Power Inspection Design by Internet of Things and RFID Technology in Smart City

    Author: Yang, Bo; Tang, Jun; Dong, Xiaofeng; Li, Shi; Gu, Ren; Hao, Junhua

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104510

  • A simple and effective multi-person pose estimation model for low power embedded system

    Author: Li, Hua; Wen, Shiping; Shi, Kaibo

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104739

  • A lattice Boltzmann model for the Navier-Stokes equation

    Author: Xu, Wenchao; Yan, Guangwu

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2021.104391

  • Road surface state recognition using deep convolution network on the embedded device

    Author: Gin, QiXin; Wang, Guangying; Wang, Lei; Cheng, Jun; Fang, Hao

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104740

  • A new idea in response to fast correlation attacks on small-state stream ciphers

    Author: Ghafari, Vahid Amin; Lin, Fujiang; Zhou, Zhongzhi

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104720

  • Lightweight image super-resolution via overlapping back-projection feedback network for embedded devices

    Author: Wang, Beibei; Liu, Changjun; Yan, Binyu; Jeon, Seunggil; Yang, Xiaomin; Zhang, Zhuoyue

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104777

  • Convolutional networks with short-term memory effects

    Author: Gong, Chencheng; Chen, Ling; Liu, Xin

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104779

  • An end-to-end medical image fusion network based on Swin-transformer

    Author: Yu, Kaixin; Yang, Xiaoming; Jeon, Seunggil; Dou, Qingyu

    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104781