Ieee Electron Device Letters

Ieee Electron Device Letters

IEEE 电子器件字母

  • 2区 中科院分区
  • Q2 JCR分区

期刊简介

《Ieee Electron Device Letters》是由Institute of Electrical and Electronics Engineers Inc.出版社于1980年创办的英文国际期刊(ISSN: 0741-3106,E-ISSN: 1558-0563),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为工程技术-工程:电子与电气。作为SCIE收录期刊(JCR分区 Q2,中科院 2区),本刊采用OA未开放获取模式(OA占比0%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比100.00%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在477篇,确保学术质量与前沿性。成果覆盖Web of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

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投稿提示

Ieee Electron Device Letters审稿周期约为 约1.3个月 。该刊近年未被列入国际预警名单,年发文量约477篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCIE 期刊收录
  • 477 发文量

中科院分区

中科院 SCI 期刊分区 2023年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

中科院 SCI 期刊分区 2022年12月升级版

Top期刊 综述期刊 大类学科 小类学科
工程技术
2区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区

JCR分区

按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 94 / 352

73.4%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 77 / 354

78.39%

CiteScore

CiteScore SJR SNIP CiteScore 排名
CiteScore:8.2 SJR:1.25 SNIP:1.5
学科类别 分区 排名 百分位
大类:Engineering 小类:Electrical and Electronic Engineering Q1 128 / 797

84%

大类:Engineering 小类:Electronic, Optical and Magnetic Materials Q1 51 / 284

82%

期刊发文

  • Development of a Cesium Vapor MEMS Cell for Differential Measurement of Microwave Electromagnetically Induced Transparency

    Author: Zhu, Jingtong; Zhao, Rui; Li, Zhonghao; Hao, Desheng; Zu, Kaixuan; Shi, Yunbo; Tang, Jun; Liu, Jun

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 132-135. DOI: 10.1109/LED.2022.3219922

  • Ultradense One-Memristor Ternary-Content-Addressable Memory Based on Ferroelectric Diodes

    Author: Zhang, Zhaohao; Zhang, Fan; Zhang, Yadong; Xu, Gaobo; Wu, Zhenhua; Zhang, Qingzhu; Li, Yongliang; Yin, Huaxiang; Luo, Jun; Wang, Wenwu; Ye, Tianchun

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 64-67. DOI: 10.1109/LED.2022.3223335

  • Photolithographic Patterning of Polypyrrole on Elastic Polydimethylsiloxane for Flexible and Conformal Organic Electronics

    Author: Zhang, Tao; Wang, Xue; Tong, Yanhong; Sun, Jing; Zhao, Xiaoli; Liu, Xiaoqian; Han, Xu; Tang, Qingxin; Liu, Yichun

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 76-79. DOI: 10.1109/LED.2022.3221521

  • Investigation to the Carrier Transport Properties in Heterojunction-Channel Amorphous Oxides Thin-Film Transistors Using Dual-Gate Bias

    Author: Yang, Huan; Zhou, Xiaoliang; Lu, Lei; Zhang, Shengdong

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 68-71. DOI: 10.1109/LED.2022.3223080

  • An Actively-Passivated p-GaN Gate HEMT With Screening Effect Against Surface Traps

    Author: Wu, Yanlin; Wei, Jin; Wang, Maojun; Nuo, Muqin; Yang, Junjie; Lin, Wei; Zheng, Zheyang; Zhang, Li; Hua, Mengyuan; Yang, Xuelin; Hao, Yilong; Chen, Kevin J.; Shen, Bo

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 25-28. DOI: 10.1109/LED.2022.3222170

  • Excitation/Inhibition Balancing in 2D Synaptic Transistors With Minority-Carrier Charge Dynamics

    Author: Wu, Rongqi; Liu, Xiaochi; Wang, Zhongwang; Jing, Yumei; Yuan, Yahua; Tang, Kui; Dai, Xianfu; Qiu, Aocheng; Jaiswal, Hemendra N.; Sun, Jia; Li, Huamin; Sun, Jian

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 156-159. DOI: 10.1109/LED.2022.3224471

  • 2.69 kV/2.11 m Omega center dot cm(2) and Low Leakage p-GaN Stripe Array Gated Hybrid Anode Diodes With Low Turn-on Voltage

    Author: Wei, Xing; Shen, Wenchao; Zhou, Xin; Tang, Wenbo; Ma, Yongjian; Chen, Tiwei; Wang, Dawei; Fu, Houqiang; Zhang, Xiaodong; Lin, Wenkui; Yu, Guohao; Cai, Yong; Zhang, Baoshun

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 13-16. DOI: 10.1109/LED.2022.3220600

  • Low Temperature Cu-Cu Bonding Using an Intermediate Sacrificial Sn Layer

    Author: Wang, Zilin; Shi, Yunfan; Wang, Zheyao

    Journal: IEEE ELECTRON DEVICE LETTERS. 2023; Vol. 44, Issue 1, pp. 116-119. DOI: 10.1109/LED.2022.3221375