Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

焊接和表面贴装技术

  • 4区 中科院分区
  • Q2 JCR分区

发文分析

近年国家/地区发文量统计

国家/地区 数量
CHINA MAINLAND 31
Malaysia 19
Hungary 13
Poland 11
USA 9
Czech Republic 8
India 7
Pakistan 6
Taiwan 5
GERMANY (FED REP GER) 3

近年机构发文量统计

机构 数量
BUDAPEST UNIVERSITY OF TECHNOLOGY & ECONOMICS 13
UNIVERSITI SAINS MALAYSIA 11
CZECH TECHNICAL UNIVERSITY PRAGUE 7
UNIVERSITI KEBANGSAAN MALAYSIA 7
AGH UNIVERSITY OF SCIENCE & TECHNOLOGY 6
HARBIN UNIVERSITY OF SCIENCE & TECHNOLOGY 4
UNIVERSITY OF MALAYSIA PERLIS 4
AGRICULTURAL UNIVERSITY PESHAWAR 3
BEIJING UNIVERSITY OF TECHNOLOGY 3
CAPITAL UNIV SCI & TECHNOL 3

近年文章引用他刊数据

文章名称 引用次数
Convection vs vapour phase reflow in LED and BGA assembl... 6
Nickel effects on the structural and some physical prope... 5
Experimental and numerical investigations of the vibrati... 5
Measurement and regulation of saturated vapour height le... 4
Correlation of microstructural evolution and hardness pr... 4
The influence of a soldering manner on thermal propertie... 3
Residual free solder process for fluxless solder pastes 3
Microstructure of Sn-20In-2.8Ag solder and mechanical pr... 3
Corrosion characterization of Sn-Zn solder: a review 3
SAC-xTiO(2) nano-reinforced lead-free solder joint chara... 3

近年被他刊引用数据

期刊名称 引用次数
SOLDER SURF MT TECH 75
J MATER SCI-MATER EL 27
IEEE T COMP PACK MAN 15
MATER RES EXPRESS 15
CIRCUIT WORLD 14
J ELECTRON MATER 14
INT J ADV MANUF TECH 11
MICROELECTRON RELIAB 11
J ALLOY COMPD 9
MATERIALS 9