| Convection vs vapour phase reflow in LED and BGA assembly |
6 |
| Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy |
5 |
| Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys |
5 |
| Measurement and regulation of saturated vapour height level in VPS chamber |
4 |
| Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition |
4 |
| The influence of a soldering manner on thermal properties of LED modules |
3 |
| Residual free solder process for fluxless solder pastes |
3 |
| Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with Cu |
3 |
| Corrosion characterization of Sn-Zn solder: a review |
3 |
| SAC-xTiO(2) nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly |
3 |
| Machine learning framework for predicting reliability of solder joints |
3 |
| Advances in pressure sensing for vapour phase soldering process monitoring |
3 |
| Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specifications |
3 |
| Solder joint inspection using eigensolder features |
3 |
| Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy |
3 |
| A method for optimizing stencil cleaning time in solder paste printing process |
3 |
| Optimising pin-in-paste technology using gradient boosted decision trees |
2 |
| Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach |
2 |
| Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire |
2 |
| Non-Newtonian numerical modelling of solder paste viscosity measurement |
2 |
| Vapour phase soldering (VPS) technology: a review |
2 |
| Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature |
2 |
| Influence of thermal shock cycles on Sn-37Pb solder bumps |
2 |
| Rheology of F620 solder paste and flux |
2 |
| Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system |
2 |
| Investigating the attack angle of squeegees with different geometries |
2 |
| Stress analysis of pressure-assisted sintering for the double-side assembly of power module |
2 |
| Stable interconnections for LTCC micro-heater using isothermal solidification technique |
2 |
| Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging |
1 |
| Characterisation of Cu/Cu bonding using self-assembled monolayer |
1 |
| Failure analysis of solder layer in power transistor |
1 |
| Rheological characterization of non-Brownian suspensions based on structure kinetics |
1 |
| Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate - theoretical and experimental study |
1 |
| Reliability studies of InnoLot and SnBi joints soldered on DBC substrate |
1 |
| Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders |
1 |
| Effects of solder paste on thermal and optical performance of high-power ThinGaN white LED |
1 |
| A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics |
1 |
| Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles |
1 |
| Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering |
1 |
| Experimental approach to thermal conductivity of macro solder joints with voids |
1 |
| Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering |
1 |
| Characterization of SAC - x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly |
1 |
| Applying data mining methodology to establish an intelligent decision system for PCBA process |
1 |
| Transient liquid phase bonding in the Cu-Sn system |
1 |
| Study on the strength of diameter-reducing solder balls by shear and pull tests |
1 |
| Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry |
0 |
| Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding |
0 |
| Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint |
0 |
| Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability |
0 |
| Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder |
0 |
