Ieee Journal Of The Electron Devices Society

Ieee Journal Of The Electron Devices Society

IEEE电子器件学会杂志

  • 3区 中科院分区
  • Q2 JCR分区

期刊简介

《Ieee Journal Of The Electron Devices Society》是由Institute of Electrical and Electronics Engineers Inc.出版社于2013年创办的英文国际期刊(ISSN: 2168-6734,E-ISSN: 2168-6734),该期刊长期致力于工程:电子与电气领域的创新研究,主要研究方向为Biochemistry, Genetics and Molecular Biology-Biotechnology。作为SCI、SCIE收录期刊(JCR分区 Q2,中科院 3区),本刊采用OA开放获取模式(OA占比%),以发表工程:电子与电气领域等方向的原创性研究为核心(研究类文章占比100.00%%)。凭借严格的同行评审与高效编辑流程,期刊年载文量精选控制在179篇,确保学术质量与前沿性。成果覆盖Web of ScienceWeb of Science、Scopus等国际权威数据库,为学者提供推动工程技术领域高水平交流平台。

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投稿提示

Ieee Journal Of The Electron Devices Society审稿周期约为9 Weeks。该刊近年未被列入国际预警名单,年发文量约179篇,录用竞争适中,主题需确保紧密契合工程技术前沿。投稿策略提示:避开学术会议旺季投稿以缩短周期,语言建议专业润色提升可读性。

  • 工程技术 大类学科
  • English 出版语言
  • 是否预警
  • SCI、SCIE 期刊收录
  • 179 发文量

中科院分区

《新锐期刊分区表》(2026年3月发布)

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区

期刊分区表(2025年3月升级版)

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
4区

期刊分区表(2023年12月升级版)

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
4区

期刊分区表(2022年12月升级版)

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区

期刊分区表(2021年12月升级版)

Top期刊 综述期刊 大类学科 小类学科
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 174 / 369

53

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 172 / 371

53.77

2023-2024年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 202 / 352

42.8

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 179 / 354

49.58

CiteScore(2026年6月最新版)

CiteScore SJR SNIP CiteScore 排名
CiteScore:4.8 SJR:0.506 SNIP:1.217
学科类别 分区 排名 百分位
大类:Engineering 小类:Electrical and Electronic Engineering Q2 338 / 1030

67%

大类:Engineering 小类:Electronic, Optical and Magnetic Materials Q2 130 / 318

59%

大类:Engineering 小类:Biotechnology Q2 152 / 325

53%

期刊发文

  • Microchannel Cooling for Performance Enhancement of GaN-on-Si HEMT With a Low Rj-a of 13.5 K/

    Author: Zhou, Jiajun; Feng, Xin; Zhang, Weihang; Dang, Kui; Zhang, Yachao; Ren, Zeyang; He, Yanjing; Liu, Xianhe; Zhou, Hong; Liu, Zhihong; Hao, Yue; Zhang, Jincheng

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2026; Vol. 14, Issue , pp. 85-92. DOI: 10.1109/JEDS.2026.3658238

  • Miller-Current Suppressing Technology for False Turn-On Protection of Commercial p-GaN HEMT

    Author: Liu, Ziheng; He, Jiayin; Peng, Hongjie; Gao, Ju; Xia, Wenbo; Ao, Chengkang; Wang, Jinyan; Wang, Maojun; Wei, Jin; Xie, Yong

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2026; Vol. 14, Issue , pp. 113-121. DOI: 10.1109/JEDS.2026.3661537

  • Simulation Study on the Scalability of Channel-All-Around Reconfigurable Field-Effect Transistors With Gate-Controlled Polarit

    Author: Huo, Ran; Ou, Shijun; Wu, Zhehao; Zhang, Han; Lv, Bowen; Shao, Yvyang; Ma, Zichao; Zhang, Min; Chan, Mansun; Zhou, Changjian

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2026; Vol. 14, Issue , pp. 93-101. DOI: 10.1109/JEDS.2026.3659128

  • Research on 4H-SiC Photoconductive Semiconductor Switch Employing Composite Anti-Reflection Coatin

    Author: Lv, Haojie; Yu, Xiaoqing; Li, Lun; Zhang, Peiyu

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2026; Vol. 14, Issue , pp. 137-144. DOI: 10.1109/JEDS.2026.3662337

  • Evaluation of Interface Traps Within Drift Region in LDMOS Using a Multi-Pulse Test Metho

    Author: Guo, Qianwen; Cao, Jiawei; Zhou, Ke; Liu, Fang; Zhao, Dongyan; Chen, Yanning; Wu, Bo; Deng, Yongfeng; Gao, Dawei; Ke, Xugang; Li, Junkang; Zhang, Rui

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2026; Vol. 14, Issue , pp. 145-150. DOI: 10.1109/JEDS.2026.3661617

  • Dynamic Evolution of Hydrogen in IGZO Transistors for PBTI Improvement by Low-Temperature Atmosphere Annealin

    Author: Xiang, Liang; Yan, Gangping; Yang, Hong; Yang, Shangbo; Xu, Gaobo; Sun, Mingyang; Wang, Guilei; Yin, Huaxiang; Wang, Xiaolei; Luo, Jun; Wang, Wenwu

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2026; Vol. 14, Issue , pp. 30-35. DOI: 10.1109/JEDS.2025.3642582

  • Understanding Frequency Dependence of Trap Generation Under AC Positive Bias Temperature Instability Stress in Si n-FinFET

    Author: Shi, Yunfei; Chang, Hao; Yang, Hong; Zhang, Qiangzhu; Liu, Qianqian; Tang, Bo; Zhou, Longda; Ji, Zhigang; Li, Junjie; He, Xiaobin; Li, Junfeng; Yin, Huaxiang; Wang, Xiaolei; Luo, Jun; Wang, Wenwu

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2025; Vol. 13, Issue , pp. 450-455. DOI: 10.1109/JEDS.2025.3567049

  • Impact of the Schottky Barrier Height on the Carrier Velocity Overshoot Behaviors in SOI nMOSFETs With Metal Source/Drai

    Author: Su, Rui; Jing, Yan; Zhang, Xinyi; Jiang, Yi; Gao, Dawei; Schwarzenbach, Walter; Nguyen, Bich-Yen; Li, Junkang; Robertson, John; Zhang, Rui

    Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY. 2025; Vol. 13, Issue , pp. 464-470. DOI: 10.1109/JEDS.2025.3569242