发文分析
近年国家/地区发文量统计
| 国家/地区 | 数量 |
|---|---|
| USA | 52 |
| CHINA MAINLAND | 51 |
| India | 50 |
| Taiwan | 35 |
| France | 20 |
| Italy | 18 |
| Belgium | 15 |
| Austria | 14 |
| Japan | 13 |
| GERMANY (FED REP GER) | 12 |
近年机构发文量统计
| 机构 | 数量 |
|---|---|
| INDIAN INSTITUTE OF TECHNOLOGY SYSTEM (IIT SYS... | 23 |
| IMEC | 15 |
| CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (... | 14 |
| STMICROELECTRONICS | 10 |
| TECHNISCHE UNIVERSITAT WIEN | 9 |
| NATIONAL TSING HUA UNIVERSITY | 8 |
| NATIONAL YANG MING CHIAO TUNG UNIVERSITY | 8 |
| COMMUNAUTE UNIVERSITE GRENOBLE ALPES | 7 |
| GLOBALFOUNDRIES | 7 |
| CHINESE ACADEMY OF SCIENCES | 6 |
近年文章引用他刊数据
| 文章名称 | 引用次数 |
|---|---|
| A First-Principles Study of the SF6 Decomposed Products ... | 23 |
| Understanding BTI in SiC MOSFETs and Its Impact on Circu... | 9 |
| Comparative Thermal and Structural Characterization of S... | 9 |
| Output-Power Enhancement for Hot Spotted Polycrystalline... | 8 |
| Rapid Solder Interconnect Fatigue Life Test Methodology ... | 7 |
| Study of Long Term Drift of Aluminum Oxide Thin Film Cap... | 7 |
| Impacts of Process and Temperature Variations on the Cro... | 6 |
| Comparative Study of Reliability of Ferroelectric and An... | 6 |
| A Compact and Self-Isolated Dual-Directional Silicon Con... | 6 |
| A Review on Hot-Carrier-Induced Degradation of Lateral D... | 6 |
近年被他刊引用数据
| 期刊名称 | 引用次数 |
|---|---|
| IEEE T ELECTRON DEV | 127 |
| IEEE T DEVICE MAT RE | 93 |
| MICROELECTRON RELIAB | 88 |
| IEEE ACCESS | 47 |
| IEEE T NUCL SCI | 37 |
| IEEE ELECTR DEVICE L | 36 |
| IEICE ELECTRON EXPR | 35 |
| IEEE T POWER ELECTR | 31 |
| J MATER SCI-MATER EL | 31 |
| ELECTRONICS-SWITZ | 30 |