| A First-Principles Study of the SF6 Decomposed Products Adsorbed Over Defective WS2 Monolayer as Promising Gas Sensing Device |
23 |
| Understanding BTI in SiC MOSFETs and Its Impact on Circuit Operation |
9 |
| Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling |
9 |
| Output-Power Enhancement for Hot Spotted Polycrystalline Photovoltaic Solar Cells |
8 |
| Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability |
7 |
| Study of Long Term Drift of Aluminum Oxide Thin Film Capacitive Moisture Sensor |
7 |
| Impacts of Process and Temperature Variations on the Crosstalk Effects in Sub-10 nm Multilayer Graphene Nanoribbon Interconnects |
6 |
| Comparative Study of Reliability of Ferroelectric and Anti-Ferroelectric Memories |
6 |
| A Compact and Self-Isolated Dual-Directional Silicon Controlled Rectifier (SCR) for ESD Applications |
6 |
| A Review on Hot-Carrier-Induced Degradation of Lateral DMOS Transistor |
6 |
| Multiple Defects Cause Degradation After High Field Stress in AlGaN/GaN HEMTs |
6 |
| Low Leakage Fully Half-Select-Free Robust SRAM Cells With BTI Reliability Analysis |
6 |
| Role of Plastic Behaviors of Ni3Sn4 Intermetallic Compound on Solder Joint Reliability |
5 |
| Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates |
5 |
| Improved Performance of Amorphous InGaZnO Thin-Film Transistor by Hf Incorporation in La2O3 Gate Dielectric |
5 |
| Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies |
5 |
| Effects of Thermo-Mechanical Fatigue and Low Cycle Fatigue Interaction on Performance of Solder Joints |
5 |
| Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding |
4 |
| Impact of the NAND Flash Power Supply on Solid State Drives Reliability and Performance |
4 |
| Assessing AMS-RF Test Quality by Defect Simulation |
4 |
| Influence of Randomness During the Interpretation of Results From Single-Event Experiments on SRAMs |
4 |
| Thermal Analysis Approach for Predicting Power Device Lifetime |
4 |
| Adaptive Body Biasing Circuit for Reliability and Variability Compensation of a Low Power RF Amplifier |
4 |
| Self-Heating Effects on Hot Carrier Degradation and Its Impact on Logic Circuit Reliability |
4 |
| On the Impact of the Gate Work-Function Metal on the Charge Trapping Component of NBTI and PBTI |
4 |
| Novel Photovoltaic Micro Crack Detection Technique |
4 |
| Characterization of Deep and Shallow Traps in GaN HEMT Using Multi-Frequency C-V Measurement and Pulse-Mode Voltage Stress |
4 |
| Online Estimation of the Junction Temperature Based on the Gate Pre-Threshold Voltage in High-Power IGBT Modules |
4 |
| Feasibility of Room-Temperature GHz-THz Direct Detection in Graphene Through Hot-Carrier Effect |
4 |
| Analysis of Breakdown Voltages in AlGaN/GaN HEMTs With Low-k/High-k Double Passivation Layers |
3 |
| IGBT Junction Temperature Measurements: Inclusive of Dynamic Thermal Parameters |
3 |
| Novel Photovoltaic Hot-Spotting Fault Detection Algorithm |
3 |
| Multiple Node Upset-Tolerant Latch Design |
3 |
| Bending Performance of Flexible Organic Thin-Film Transistors With/Without Encapsulation Layer |
3 |
| Majority Voting-Based Reduced Precision Redundancy Adders |
3 |
| Analytical Layout Dependent NBTI Degradation Modeling Based on Non-Uniformly Distributed Interface Traps |
3 |
| Multilevel Redundancy Allocation for SEU Mitigation of DSP Codes Based on OMA |
3 |
| Empirical Solutions and Reliability Assessment of Thermal Induced Creep Failure for Wafer Level Packaging |
3 |
| Process Variation and NBTI Resilient Schmitt Trigger for Stable and Reliable Circuits |
3 |
| Electromigration Check: Where the Design and Reliability Methodologies Meet |
3 |
| Efficient Output Power Enhancement and Protection Technique for Hot Spotted Solar Photovoltaic Modules |
3 |
| Life Model of the Electrochemical Migration Failure of Printed Circuit Boards Under NaCl Solution |
2 |
| Probing Plasticity and Strain-Rate Effects of Indium Submicron Pillars Using Synchrotron Laue X-Ray Microdiffraction |
2 |
| Temporally- and Spatially-Resolved Observations of Current Filament Dynamics in Insulated Gate Bipolar Transistor Chip During Avalanche Breakdown |
2 |
| Self-Heating Assessment on Bulk FinFET Devices Through Characterization and Predictive Simulation |
2 |
| Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite-Element Analysis |
2 |
| The Impact of Fin Number on Device Performance and Reliability for Multi-Fin Tri-Gate n- and p-Type FinFET |
2 |
| Analysis of the Significant Rise in Breakdown Voltage of GaN HEMTs From Near-Threshold to Deep Off-State Gate Bias Conditions |
2 |
| Circuit-Level Technique to Design Variation- and Noise-Aware Reliable Dynamic Logic Gates |
2 |
| Elimination of Scallop-Induced Stress Fluctuation on Through-Silicon-Vias (TSVs) by Employing Polyimide Liner |
2 |
