| Comphy - A compact-physics framework for unified modeling of BTI |
25 |
| An improved unscented particle filter approach for lithium-ion battery remaining useful life prediction |
25 |
| Threshold voltage peculiarities and bias temperature instabilities of SiC MOSFETs |
21 |
| Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence |
16 |
| Controversial issues in negative bias temperature instability |
13 |
| An Android mutation malware detection based on deep learning using visualization of importance from codes |
13 |
| A review of NBTI mechanisms and models |
12 |
| New dynamic electro-thermo-optical model of power LEDs |
12 |
| Measurement considerations for evaluating BTI effects in SiC MOSFETs |
11 |
| Border traps and bias-temperature instabilities in MOS devices |
10 |
| Remaining useful life prediction for lithium-ion batteries based on an integrated health indicator |
9 |
| Lithium-ion battery state of health estimation with short-term current pulse test and support vector machine |
8 |
| Remaining useful life prediction of aviation circular electrical connectors using vibration-induced physical model and particle filtering method |
7 |
| Impact of interface traps on performance of Gate-on-Source/Channel SOI TFET |
7 |
| Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation |
7 |
| Review of bias-temperature instabilities at the III-N/dielectric interface |
7 |
| Thermal behaviors of nanoparticle reinforced epoxy resins for microelectronics packaging |
7 |
| Comparison of lithium-ion battery performance at beginning-of-life and end-of-life |
7 |
| A brief overview of gate oxide defect properties and their relation to MOSFET instabilities and device and circuit time-dependent variability |
7 |
| Heuristic Kalman optimized particle filter for remaining useful life prediction of lithium-ion battery |
7 |
| Mutual and self-aging effects of power semiconductors on the thermal behaviour of DC-DC boost power converter |
7 |
| Online condition monitoring of IGBT modules using voltage change rate identification |
7 |
| The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints |
7 |
| Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints |
6 |
| A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys |
6 |
| Calendar and cycling ageing combination of batteries in electric vehicles |
6 |
| Effect of short-circuit stress on the degradation of the SiO2 dielectric in SiC power MOSFETs |
6 |
| Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations |
6 |
| Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints |
6 |
| Ensure an original and safe fail-to-open mode in planar and trench power SiC MOSFET devices in extreme short-circuit operation |
6 |
| Fault diagnosis for the motor drive system of urban transit based on improved Hidden Markov Model |
6 |
| Experimental identification of LED compact thermal model element values |
6 |
| Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method |
6 |
| Integrated modeling of Self-heating of confined geometry (FinFET, NWFET, and NSHFET) transistors and its implications for the reliability of sub-20 nm modern integrated circuits |
6 |
| Heavy ion irradiation effects on GaN/AlGaN high electron mobility transistor failure at off-state |
6 |
| Hotspots and performance evaluation of crystalline-silicon and thin-film photovoltaic modules |
6 |
| Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder |
6 |
| Atmospheric neutron single event effect test on Xilinx 28 nm system on chip at CSNS-BL09 |
6 |
| Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling |
6 |
| Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems |
5 |
| Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology |
5 |
| IGBT junction and coolant temperature estimation by thermal model |
5 |
| Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect |
5 |
| Metallized film capacitors used for EMI filtering: A reliability review |
5 |
| The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface |
5 |
| An artificial neural network approach for wafer dicing saw quality prediction |
5 |
| Failure and failure characterization of QFP package interconnect structure under random vibration condition |
5 |
| A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions |
5 |
| Effect of aging on mechanical properties of high temperature Pb-rich solder joints |
5 |
| Design, manufacture and test for reliable 3D printed electronics packaging |
5 |
