发文分析
近年国家/地区发文量统计
| 国家/地区 | 数量 |
|---|---|
| USA | 226 |
| CHINA MAINLAND | 208 |
| Taiwan | 71 |
| South Korea | 51 |
| GERMANY (FED REP GER) | 49 |
| India | 47 |
| Japan | 46 |
| Canada | 40 |
| England | 24 |
| France | 22 |
近年机构发文量统计
| 机构 | 数量 |
|---|---|
| UNIVERSITY SYSTEM OF GEORGIA | 49 |
| KOREA ADVANCED INSTITUTE OF SCIENCE & TECHNOLO... | 26 |
| INTEL CORPORATION | 21 |
| INDIAN INSTITUTE OF TECHNOLOGY SYSTEM (IIT SYS... | 20 |
| AUBURN UNIVERSITY SYSTEM | 18 |
| HARBIN INSTITUTE OF TECHNOLOGY | 18 |
| SOUTH CHINA UNIVERSITY OF TECHNOLOGY | 15 |
| SOUTHEAST UNIVERSITY - CHINA | 15 |
| UNIVERSITY OF CALIFORNIA SYSTEM | 15 |
| CHINESE ACADEMY OF SCIENCES | 14 |
近年文章引用他刊数据
| 文章名称 | 引用次数 |
|---|---|
| A Study on the Optimization of Anisotropic Conductive Fi... | 13 |
| Design and Packaging of an Eye-Shaped Multiple-Input-Mul... | 12 |
| Device-Level Thermal Management of Gallium Oxide Field-E... | 11 |
| SMT Solder Joint Inspection via a Novel Cascaded Convolu... | 10 |
| Direct-Acting Piezoelectric Jet Dispenser With Rhombic M... | 10 |
| Wire Defect Recognition of Spring-Wire Socket Using Mult... | 10 |
| Inkjet Printing of Wideband Stacked Microstrip Patch Arr... | 10 |
| The Effect of Solder Joint Microstructure on the Drop Te... | 9 |
| Stochastic Collocation With Non-Gaussian Correlated Proc... | 9 |
| Defect Detection in Electronic Surfaces Using Template-B... | 8 |
近年被他刊引用数据
| 期刊名称 | 引用次数 |
|---|---|
| IEEE T COMP PACK MAN | 675 |
| IEEE ACCESS | 272 |
| INT J HEAT MASS TRAN | 150 |
| IEEE T MICROW THEORY | 123 |
| MICROELECTRON RELIAB | 98 |
| APPL THERM ENG | 81 |
| J MATER SCI-MATER EL | 77 |
| J ELECTRON PACKAGING | 71 |
| IET MICROW ANTENNA P | 69 |
| IEEE T ELECTROMAGN C | 57 |