| A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature |
13 |
| Design and Packaging of an Eye-Shaped Multiple-Input-Multiple-Output Antenna With High Isolation for Wireless UWB Applications |
12 |
| Device-Level Thermal Management of Gallium Oxide Field-Effect Transistors |
11 |
| SMT Solder Joint Inspection via a Novel Cascaded Convolutional Neural Network |
10 |
| Direct-Acting Piezoelectric Jet Dispenser With Rhombic Mechanical Amplifier |
10 |
| Wire Defect Recognition of Spring-Wire Socket Using Multitask Convolutional Neural Networks |
10 |
| Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates |
10 |
| The Effect of Solder Joint Microstructure on the Drop Test Failure-A Peridynamic Analysis |
9 |
| Stochastic Collocation With Non-Gaussian Correlated Process Variations: Theory, Algorithms, and Applications |
9 |
| Defect Detection in Electronic Surfaces Using Template-Based Fourier Image Reconstruction |
8 |
| Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers |
8 |
| Influence of a Soldering Process on Thermal Parameters of Large Power LED Modules |
8 |
| Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration |
8 |
| Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages |
8 |
| Dynamic Performance of Electrical Connector Contact Resistance and Intermittent Fault Under Vibration |
7 |
| Thermal Management of Electronic Devices Using Combined Effects of Nanoparticle Coating and Graphene-Water Nanofluid in a Miniature Loop Heat Pipe |
7 |
| An sEMG-Based Human-Robot Interface for Robotic Hands Using Machine Learning and Synergies |
7 |
| Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink Array for Two-Phase Cooling |
7 |
| Independently Tunable/Controllable Differential Dual-Band Bandpass Filters Using Element-Loaded Stepped-Impedance Resonators |
7 |
| Nonlinear Damage Accumulation Rule for Solder Life Prediction Under Combined Temperature Profile With Varying Amplitude |
7 |
| Crosstalk Suppression Based on Mode Mismatch Between Spoof SPP Transmission Line and Microstrip |
7 |
| Compact Selective Bandpass Filter With Wide Stopband for TETRA Band Applications |
7 |
| An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics |
6 |
| Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure |
6 |
| Zero-Gap Waveguide: A Parallel Plate Waveguide With Flexible Mechanical Assembly for mm-Wave Antenna Applications |
6 |
| Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration |
6 |
| Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint |
6 |
| Arcless Commutation of a Hybrid DC Breaker by Contact Voltage of Molten Metal Bridge |
6 |
| High-Frequency Characterization and Modeling of Coaxial Connectors With Degraded Contact Surfaces |
6 |
| Substrate-Integrated Waveguide Dual-Band Filters With Closely Spaced Passbands and Flexibly Allocated Bandwidths |
6 |
| Fan-Out Wafer-Level Packaging for Heterogeneous Integration |
6 |
| Embedded Multidie Interconnect Bridge-A Localized, High-Density Multichip Packaging Interconnect |
6 |
| Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems |
6 |
| Novel Electronic Packaging Method for Functional Electronic Textiles |
6 |
| Planar In-Phase Filtering Power Divider With Tunable Power Division and Controllable Band for Wireless Communication Systems |
6 |
| New Process for Selective Additive Metallization of Alumina Ceramic Substrates |
5 |
| 3-D Printing of Conformal Antennas for Diversity Wrist Worn Applications |
5 |
| Modeling of Capacitive Resonant Wireless Power and Data Transfer to Deep Biomedical Implants |
5 |
| IC Solder Joint Inspection Based on an Adaptive-Template Method |
5 |
| Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface |
5 |
| Multi-Physics Modeling and Characterization of Components on Flexible Substrates |
5 |
| Innovative Sub-5-mu m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects |
5 |
| An Improved Ultrawideband Open-Short De-Embedding Method Applied up to 220 GHz |
5 |
| A Scalable and Multidirectional Rectenna System for RF Energy Harvesting |
5 |
| Broadband Filtering Power Dividers Using Simple Three-Line Coupled Structures |
5 |
| Very Sharp Roll-Off Ultrawide Stopband Low-Pass Filter Using Modified Flag Resonator |
5 |
| Expected Failures in 3-D Technology and Related Failure Analysis Challenges |
5 |
| Hybrid Cooling System for Electronics Equipment During Power Surge Operation |
5 |
| Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life |
5 |
| Design and Analysis of the DC-DC Converter With a Frequency Hopping Technique for EMI Reduction |
4 |
