发文分析
近年国家/地区发文量统计
| 国家/地区 | 数量 |
|---|---|
| USA | 101 |
| CHINA MAINLAND | 38 |
| Taiwan | 11 |
| GERMANY (FED REP GER) | 6 |
| South Korea | 6 |
| England | 5 |
| Canada | 3 |
| France | 3 |
| India | 3 |
| Japan | 3 |
近年机构发文量统计
| 机构 | 数量 |
|---|---|
| UNIVERSITY SYSTEM OF GEORGIA | 10 |
| HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY | 9 |
| STATE UNIVERSITY OF NEW YORK (SUNY) SYSTEM | 9 |
| AUBURN UNIVERSITY SYSTEM | 8 |
| PENNSYLVANIA COMMONWEALTH SYSTEM OF HIGHER EDU... | 7 |
| PURDUE UNIVERSITY SYSTEM | 7 |
| UNITED STATES DEPARTMENT OF DEFENSE | 7 |
| UNITED STATES DEPARTMENT OF ENERGY (DOE) | 7 |
| UNIVERSITY SYSTEM OF MARYLAND | 7 |
| INTEL CORPORATION | 6 |
近年文章引用他刊数据
| 文章名称 | 引用次数 |
|---|---|
| Review of Thermal Packaging Technologies for Automotive ... | 9 |
| Recent Advances and Trends in Fan-Out Wafer/Panel-Level ... | 7 |
| Study on Reabsorption Properties of Quantum Dot Color Co... | 7 |
| A State-of-the-Art Review of Fatigue Life Prediction Mod... | 6 |
| Progress and Perspective of Near-Ultraviolet and Deep-Ul... | 5 |
| Low Temperature Cu-Cu Bonding Technology in Three-Dimens... | 5 |
| Thermal Metamaterials for Heat Flow Control in Electroni... | 5 |
| Thermal Management and Characterization of High-Power Wi... | 5 |
| A Wire-Bondless Packaging Platform for Silicon Carbide P... | 4 |
| Experimentally Validated Computational Fluid Dynamics Mo... | 4 |
近年被他刊引用数据
| 期刊名称 | 引用次数 |
|---|---|
| INT J HEAT MASS TRAN | 143 |
| J ELECTRON PACKAGING | 97 |
| APPL THERM ENG | 60 |
| IEEE T COMP PACK MAN | 60 |
| MICROELECTRON RELIAB | 26 |
| APPL ENERG | 22 |
| INT J THERM SCI | 20 |
| J MATER SCI-MATER EL | 16 |
| INT COMMUN HEAT MASS | 15 |
| J HEAT TRANS-T ASME | 15 |