| Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes |
9 |
| Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging |
7 |
| Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging |
7 |
| A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint |
6 |
| Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies |
5 |
| Low Temperature Cu-Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review |
5 |
| Thermal Metamaterials for Heat Flow Control in Electronics |
5 |
| Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications |
5 |
| A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices |
4 |
| Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles |
4 |
| Enhanced Heat Transfer Using Microporous Copper Inverse Opals |
4 |
| Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint |
4 |
| Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization |
4 |
| Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components |
3 |
| Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design |
3 |
| Fabrication of Multimeasurand Sensor for Monitoring of a Li-ton Battery |
3 |
| Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a |
3 |
| Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach |
3 |
| Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips |
3 |
| Regional Segregation With Spatial Considerations-Based Analytical Filling Time Modelfor Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation |
3 |
| Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation |
3 |
| Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model |
3 |
| Failure Analysis of Direct Liquid Cooling System in Data Centers |
2 |
| Reliability Considerations for Oil Immersion-Cooled Data Centers |
2 |
| Numerical Investigation of Shape Effect on Microdroplet Evaporation |
2 |
| Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis |
2 |
| Ripening Growth Kinetics of Cu6Sn5 Grains in Sn-3.0Ag-0.5Cu-xTiO(2)/Cu Solder Joints During the Reflow Process |
2 |
| Challenges in Three-Dimensional Printing of High-Conductivity Copper |
2 |
| Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers |
2 |
| Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density |
2 |
| Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies |
2 |
| Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles |
2 |
| Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking |
2 |
| Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module |
2 |
| Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects |
2 |
| Mechanical Characterization of Thermal Interface Materials and Its Challenges |
2 |
| Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps |
2 |
| Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers |
2 |
| Liquid Cooling of Compute System |
1 |
| Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms |
1 |
| Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal |
1 |
| Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices |
1 |
| Orientation Effects in Two-Phase Microgap Flow |
1 |
| Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding |
1 |
| Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging |
1 |
| Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel |
1 |
| Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation |
1 |
| Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network |
1 |
| Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure |
1 |
| Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept |
1 |
